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NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

Categories Integrated Circuit Parts
Brand Name: NXP
Model Number: LPC1114FHN33/302:5
Certification: CE,ROHS
Place of Origin: Taiwan
MOQ: 1pcs
Price: 1$/pcs~1.2$/pcs
Payment Terms: T/T, Western Union,paypal
Supply Ability: 10kpcs/month
Delivery Time: 2-4 working days after receiving the payment
Packaging Details: 260pcs/tray
Product name: MCU Flash
Standard package: 260pcs/tray
Core Size: 32-bit
Program Memory Size: 32KB (32K x 8)
Program Memory Type: Flash
Number of I/O: 28
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    NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

    NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial


    Description:

    • System:

    – ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.

    – ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).

    – Serial Wire Debug.

    – System tick timer.


    • Memory:

    – On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C

    series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB

    (LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).

    – On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB

    (LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),

    56 kB (LPC1114/333), 64 kB (LPC1115).

    – 8 kB, 4 kB, 2 kB, or 1 kB SRAM.

    – In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

    bootloader software.

    – LPC1100XL series only: page erase IAP command.


    • Digital peripherals:

    – Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down

    resistors. Number of GPIO pins is reduced for smaller packages and

    LPC11C22/C24.

    – GPIO pins can be used as edge and level sensitive interrupt sources.

    – High-current output driver (20 mA) on one pin.

    – High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.

    – Four general purpose timers/counters with a total of four capture inputs and up to

    13 match outputs.

    – Programmable WatchDog Timer (WDT).


    • Analog peripherals:

    – 10-bit ADC with input multiplexing among up to 8 pins.


    • Serial interfaces:

    – UART with fractional baud rate generation, internal FIFO, and RS-485 support.

    – Two SPI controllers with SSP features and with FIFO and multi-protocol

    capabilities (second SPI on LQFP48 packages only).

    – I

    2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a

    data rate of 1 Mbit/s with multiple address recognition and monitor mode.

    – C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.

    – On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).


    • Clock generation:

    – 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used

    as a system clock.

    – Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.

    User manual Rev. 12.3 — 10 June 2014 7 of 547

    NXP Semiconductors UM10398

    Chapter 1: LPC111x/LPC11Cxx Introductory information

    – Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.

    – PLL allows CPU operation up to the maximum CPU rate without the need for a

    high-frequency crystal. May be run from the system oscillator or the internal RC

    oscillator.

    – Clock output function with divider that can reflect the system oscillator clock, IRC

    clock, CPU clock, and the Watchdog clock.


    • Power control:

    – Integrated PMU (Power Management Unit) to minimize power consumption during

    Sleep, Deep-sleep, and Deep power-down modes.

    – Power profiles residing in boot ROM allowing to optimize performance and

    minimize power consumption for any given application through one simple function

    call. (On LPC1100L and LPC1100XL parts only).

    – Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.

    – Processor wake-up from Deep-sleep mode via a dedicated start logic using up to

    13 of the functional pins.

    – Power-On Reset (POR).

    – Brownout detect with up to four separate thresholds for interrupt and forced reset.


    • Unique device serial number for identification.

    • Single 3.3 V power supply (1.8 V to 3.6 V).

    • Available as LQFP48 package, HVQFN33 package.

    • LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,

    TSSOP20 package, and SO20 package.

    • Available as dual-chip module consisting of the LPC1114 single-chip microcontroller

    combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part

    LPC11D14FBD100/302).1


    Specification:

    Standard package

    260pcs/tray

    Category

    Integrated Circuits (ICs)

    Family

    Embedded - Microcontrollers

    Series

    LPC1100L

    Packaging

    Tray

    Core Processor

    ARM® Cortex®-M0

    Core Size

    32-Bit

    Speed

    50MHz

    Connectivity

    I²C, SPI, UART/USART

    Peripherals

    Brown-out Detect/Reset, POR, WDT

    Number of I/O

    28

    Program Memory Size

    32KB (32K x 8)

    Program Memory Type

    FLASH

    EEPROM Size

    -

    RAM Size

    8K x 8

    Voltage - Supply (Vcc/Vdd)

    1.8 V ~ 3.6 V

    Data Converters

    A/D 8x10b

    Oscillator Type

    Internal

    Operating Temperature

    -40°C ~ 85°C

    Package / Case

    32-VQFN Exposed Pad

    Supplier Device Package

    32-HVQFN (7x7)


    Ordering Information:

    Type number

    Package

    Description

    Version

    SO20, TSSOP20, TSSOP28, and DIP28 packages

     

    LPC1110FD20

    SO20

    SO20: plastic small outline package; 20 leads; body width 7.5 mm

    SOT163-1

    LPC1111FDH20/002

    TSSOP20

    TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

    SOT360-1

    LPC1112FD20/102

    SO20

    SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm

    SOT163-1

    LPC1112FDH20/102

    TSSOP20

    TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

    SOT360-1

    LPC1112FDH28/102

    TSSOP28

    TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

    SOT361-1

    LPC1114FDH28/102

    TSSOP28

    TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

    SOT361-1

    LPC1114FN28/102

    DIP28

    DIP28: plastic dual in-line package; 28 leads (600 mil)

    SOT117-1

    HVQFN24/33, LQFP48, and TFBGA48 packages

     

    LPC1111FHN33/101

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111FHN33/102

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111FHN33/201

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111FHN33/202

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111FHN33/103

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111JHN33/103

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111FHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1111JHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112FHN33/101

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112FHN33/102

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112FHN33/201

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112FHN33/202

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112FHN24/202

    HVQFN24

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm

    SOT616-3

    LPC1112FHI33/102

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

    n/a

    LPC1112FHI33/202

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

    n/a

    LPC1112FHI33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

    n/a

    LPC1112JHI33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

    n/a

    LPC1112FHN33/103

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112JHN33/103

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112JHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1112FHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FHN33/201

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FHN33/202

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113JHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FHN33/301

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FHN33/302

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FHN33/303

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113JHN33/303

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHN33/201

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHN33/202

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHN33/301

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHN33/302

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHI33/302

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHI33/303

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

    n/a

    LPC1114JHI33/303

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

    n/a

    LPC1114FHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114JHN33/203

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHN33/303

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114JHN33/303

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114FHN33/333

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1114JHN33/333

    HVQFN33

    HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

    n/a

    LPC1113FBD48/301

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1113FBD48/302

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1113FBD48/303

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1113JBD48/303

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114FBD48/301

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114FBD48/302

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114FBD48/303

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114JBD48/303

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114FBD48/323

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114JBD48/323

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114FBD48/333

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1114JBD48/333

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1115FBD48/303

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1115JBD48/303

    LQFP48

    LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

    SOT313-2

    LPC1115FET48/303

    TFBGA48

    plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm

    SOT1155-2

    LPC1115JET48/303

    TFBGA48

    plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm

    SOT1155-2


    Application:

    it is used for a Wide range of fields :

    Industrial products, communication etc


    Product show:




    Our advantage :

    • High quality products --- our offers are 100% new and original, ROHS
    • Competitive price --- good Purchase channels with good price.
    • Professional service --- strict quality testing before the shipment, and perfect after-sales service after the purchase.
    • Adequate inventory --- With the support of our strong Purchasing team,
    • Fast delivery --- we will ship the goods within 1-3 working days after the payment confirmed.

    be sure to meet your need for all kinds of components. ^_^


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    The offers including:

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    Quality NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial for sale
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