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Core I7-4510U SR1EB Intel Core I7 Laptop Processor 4MB Cache Up To 3.1GHz

Categories Laptop CPU Processors
Model Number: I7-4510U SR1EB
Certification: ORIGINAL PARTS
MOQ: 1 piece
Price: Negotiation
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500pcs
Delivery Time: 3-5 work days
Packaging Details: tray, 10cmX10cmX5cm
Processorl NO.: I7-4510U
Produce Collection: The 4th Core I7 Series Processor
Code Name: Products formerly Haswell
Vertical Segment: Mobile
Status: Launched
Launch Date: Q2'14
Lithography: 22nm
Use Conditon: Notebook
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    Core I7-4510U SR1EB Intel Core I7 Laptop Processor 4MB Cache Up To 3.1GHz

    Laptop CPU Procesors Core I7-4510U SR1EB , I7 Series (4MB Cache , up to 3.1GHz ) - Notebook CPU

    Core i7-4510U is an ULV (ultra low voltage) dual-core processor for ultrabooks launched in Q2 2014. It is based on the Haswell architecture and is manufactured in 22nm. Due to Hyper-Threading, the two cores can handle up to four threads in parallel, leading to better utilization of the CPU. Each core offers a base speed of 2.0 GHz, but can dynamically increase clock rates with Turbo Boost up to 3.1 GHz for 1 active core or 2.8 GHz for 2 active cores. That's 100 - 200 MHz more than the i7-4500U (1.8 - 3.0 GHz).


    Processor number i7-4510U


    Processor numberi7-4510U
    FamilyCore i7 Mobile
    Technology (micron)0.022
    Processor speed (GHz)2
    L2 cache size (KB)512
    L3 cache size (MB)4
    The number of cores42
    EM64TSupported
    HyperThreading technologySupported
    Virtualization technologySupported
    Enhanced SpeedStep technologySupported
    Execute-Disable bit featureSupported

    General Information:

    TypeCPU / Microprocessor
    Market segmentMobile
    FamilyIntel Core i7 Mobile
    Model numberi7-4510U
    Frequency2000 MHz
    Maximum turbo frequency3100 MHz (1 core)
    2800 MHz (2 cores)
    Bus speed5 GT/s DMI
    Clock multiplier20
    Package1168-ball micro-FCBGA package (FCBGA1168)
    SocketBGA1168
    Size1.57" x 0.94" / 4cm x 2.4cm
    Introduction dateApril 14, 2014
    End-of-Life dateLast order date for tray processors is September 30, 2016
    Last shipment date for tray processors is March 11, 2017



    Architecture Microarchiteture:

    MicroarchitectureHaswell
    PlatformShark Bay
    Processor coreHaswell
    Core steppingD0 (SR1EB)
    Manufacturing process0.022 micron
    0.96 billion transistors
    Die131mm2
    Data width64 bit
    The number of CPU cores2
    The number of threads4
    Floating Point UnitIntegrated
    Level 1 cache size2 x 32 KB 8-way set associative instruction caches
    2 x 32 KB 8-way set associative data caches
    Level 2 cache size2 x 256 KB 8-way set associative caches
    Level 3 cache size4 MB 16-way set associative shared cache
    Physical memory16 GB
    MultiprocessingUniprocessor
    Extensions and Technologies
    • MMX instructions
    • SSE / Streaming SIMD Extensions
    • SSE2 / Streaming SIMD Extensions 2
    • SSE3 / Streaming SIMD Extensions 3
    • SSSE3 / Supplemental Streaming SIMD Extensions 3
    • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
    • AES / Advanced Encryption Standard instructions
    • AVX / Advanced Vector Extensions
    • AVX2 / Advanced Vector Extensions 2.0
    • BMI / BMI1 + BMI2 / Bit Manipulation instructions
    • F16C / 16-bit Floating-Point conversion instructions
    • FMA3 / 3-operand Fused Multiply-Add instructions
    • EM64T / Extended Memory 64 technology / Intel 64
    • NX / XD / Execute disable bit
    • HT / Hyper-Threading technology
    • TBT 2.0 / Turbo Boost technology 2.0
    • VT-x / Virtualization technology
    Low power featuresEnhanced SpeedStep technology


    Intergrated Peripherals/Components:

    Integrated graphicsGPU Type: HD 4400
    Graphics tier: GT2
    Microarchitecture: Gen 7.5
    Execution units: 20
    Base frequency (MHz): 200
    Maximum frequency (MHz): 1100
    The number of supported displays: 3
    Memory controllerThe number of controllers: 1
    Memory channels: 2
    Supported memory: DDR3L-1333, DDR3L-1600, LPDDR3-1333, LPDDR3-1600
    Maximum memory bandwidth (GB/s): 25.6
    Other peripherals
    • Direct Media Interface 2.0
    • PCI Express 2.0 interface


    Eletrical/Thermal Parameters:

    Maximum operating temperature100°C
    Thermal Design Power45 Watt
    Product Tags:

    laptop chips

      

    mobile processor laptop

      
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