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MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces

Categories Heat Sink
Brand Name: JBNR
Model Number: HCMC010
Certification: ISO9001
Place of Origin: China
MOQ: Negotiation
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 5 tons a month
Delivery Time: 20 days
Packaging Details: Wooden boxes
Price: Negotiable
Grade:: Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface:: Plated or unplated
Dimensions:: Based on customer requirements
Plating:: Nickel plating and gold plaing
Shape:: Shims or sheets or fabricated parts
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    MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces

    MoCu Carriers For High Reliability Ceramic Substrates And Critical Glass-to-metal Interfaces


    Description:

    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:

    1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)


    Advantages:

    Mo/Cu offers the following advantages to our customers:

     Tailored thermal expansion to meet your specific design criteria

     Highest thermal/electrical conductivity performance available for this material

     Outstanding thermal-mechanical stability

     Critical dimensional tolerance and surface finish control

     Metallization capability including electrolytic, electroless, and thin film processes to meet your specifications  Finer particle size available for critical edge and thermal uniformity specification

     A forty percent weight savings compared to W/Cu


    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

    Quality MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces for sale
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