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7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB

Categories 2 Layer PCB
Brand Name: WITGAIN PCB
Model Number: S02E4678A0
Certification: UL Certificate
Place of Origin: China
MOQ: Negotiable
Price: Negotiable
Payment Terms: T/T
Supply Ability: 1kkpcs/month
Delivery Time: 12 work days
Packaging Details: 40pcs/bag, 20bags/carton
PCB Type: High Frequency PCB
Material: Rogers RO4350B
Layer Count: 2 Layer
Copper Thickness: 1/1OZ
Surface Treatment: ENIG
Min Hole: 0.5MM
Min Trace: 21.6/6Mil
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    7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB

    2 Layer Rigid Printed Circuit Board , High Frequency Rogers RO4350B Material


    PCB Specifications:


    Layer Count: 2 Layer Rigid PCB

    Material: RO4350B Quick-Reference-Processing-Guidelines-RO4003C-RO43...

    Board Thickness: 1.0MM

    Min Hole: 0.5MM

    Unit Size: 109MM*92MM/1SET

    Surface Treatment: ENIG


    Capabilities:


    NOItemCapability
    1Layer Count1-24 Layers
    2Board Thickness0.1mm-6.0mm
    3Finished Board Max Size700mm*800mm
    4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
    5Warp<0.7%
    6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
    7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8Drill Hole Diameter0.1mm-6.5mm
    9Out Layer Copper Thickness1/2OZ-8OZ
    10Inner Layer Copper Thickness1/3OZ-6OZ
    11Aspect Ratio10:1
    12PTH Hole Tolerance+/-3mil
    13NPTH Hole Tolerance+/-1mil
    14Copper Thickness of PTH Wall>10mil(25um)
    15Line Width And Space2/2mil
    16Min Solder Mask Bridge2.5mil
    17Solder Mask Alignment Tolerance+/-2mil
    18Dimension Tolerance+/-4mil
    19Max Gold Thickness200u'(0.2mil)
    20Thermal Shock288℃, 10s, 3 times
    21Impedance Control+/-10%
    22Test CapabilityPAD Size min 0.1mm
    23Min BGA7mil
    24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc


    FAQ:


    Question: What is PCB Etch Factor?

    Answer: PCB Etch Factor or etch compensation is an etching process modification used by the PCB manufacturers to decide the extent and accuracy of etching. It helps the designers and manufacturers decide the minimum etching allowance on the track width. During etching, unwanted copper is removed gradually from the PCB surface to realize the desired conductive track. For instance, if a PCB design requires a track width of 0.25 mm, then the manufacturer has to initiate etching if the track width is more than 0.25 mm. The amount by which the track width is increased is called etch factor. It is proportional to the copper weight required to be removed. More copper to be removed indicates a higher value of the etch factor.

    No etching process gives perfect straight cuts, they always create undercut, an etching defect, which can be seen in the figure below.

    In mathematical terms, an etch factor is the ratio of track width to the amount of undercut. The PCB CAD designer has to provide enough spacing in the design so that a manufacturer is able to utilize that space to start etching with a little wider track. The minimum spacing in the design must meet the manufacturer’s decided minimum space.


    Quality 7mil Min BGA Thick 1.0MM ENIG RO4350B 2 Layer PCB for sale
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