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Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

Categories SMT PCB Service
Brand Name: China chao sheng
Model Number: Six layers of soft and hard PCBA
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 20-25day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Board thickness: 1.6mm
Min. line width: 0.075mm/0.1mm(3mil/4mil)
Product name: Camera PCB Assembly
Service: PCB&PCBA
Layer: 1-24layers
Usage: PCB assembly
Pcb standard: IPC-II standard
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    Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

    Six layers of soft and hard combined production circuit test,wooden box carton packaging,SMT PCB Service,taconic pcb


    Product Description

    1. Six layers of soft and hard combined production + SMT, PCBA wooden box carton packaging,SMT PCB Service,taconic pcb
    2. PCBA processing method
    3. PCB production + it contains SMT, DIP, TEST,
    4. RoHS Lead Free Control Board SMT PCB Assembly 1.6mm PCB Service

      Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Technical requirement:

    1. Professional surface-mounting and through-hole soldering technology
    2. Various sizes are available, like 1206, 0805, 0603 components SMT technology
    3. ICT (in circuit test), FCT (functional circuit test) technology
    4. PCB assembly with UL, CE, FCC and RoHS approvals
    5. Nitrogen gas reflow soldering technology for SMT
    6. High standard SMT and solder assembly line
    7. High density interconnected board placement technology capacity

    Quote requirement:

    1. Gerber file of the bare PCB board
    2. BOM (bill of material) for assembly
    3. To short the lead time, please kindly advise us if there is any acceptable components substitution
    4. Testing guide and test fixtures if necessary
    5. Programming files and programming tool if necessary
    6. Schematic if necessary
    7. OEM/ODM/EMS services for PCBA:
    8. PCBA, PCB assembly: SMT, PTH and BGA
    9. PCBA and enclosure design
    10. Components sourcing and purchasing
    11. Quick prototyping
    12. Plastic injection molding
    13. Metal sheet stamping
    14. Final assembly
    15. Test: AOI, in-circuit test (ICT), functional test (FCT)
    16. Custom clearance for material importing and product exporting

    Specifications

    1. Layer: 4 layer
    2. Material: FR4
    3. Board Thickness: 1.6mm
    4. Surface Treatment: Lead free HASL
    5. Solder Mask: Green
    6. Size: 123mm*36mm
    7. Copper Thickness: 1.5oZ
    8. Min. Hole Size: 0.15mm
    9. Min. Line Width: 0.08mm
    10. Min. Line Spacing: 0.08mm
    11. Hole vias: Buried hole and blind hole

    Orientronic PCB assembly equipmet

    • Fully automatic SMT stencil printer: FolunGwin Win-5
      • SMT machine: Siemens SIPLACE D1/D2/Siemens SIPLACE S20/F4
      • Reflow oven: FolunGwin FL-RX860
      • Wave soldering machine: FolunGwin ADS300
      • Automated optical inspection (AOI): Aleader ALD-H-350B
    • Needed:
      • PCB gerber file
      • BOM list for PCB assembly
      • Send us your sample PCB board or PCBA
    • Advantages:
      • Turnkey manufacturing or quick-turn prototypes
      • Board-level assembly or complete system integration
      • Low-volume or mixed-technology assembly for PCBA
      • Even consignment production
      • Supported capabilities
    • Type of assembly:
      • THD (thru-hole device)/conventional
      • SMT (surface-mount technology)
      • SMT and THD mixed
      • Double-sided SMT and/or THD assembly
    • Components:
      • Passives, smallest size 0201
      • Fine pitch to 08 Mils
      • Leadless chip carriers/BGA, VFBGA, FPGA and DFN
      • Connectors and terminals
    • Component packaging:
      • Reels
      • Cut tape
      • Tube
      • Loose parts
    • Board dimensions:
      • Smallest size: 0.25 x 0.25 inch/6 x 6mm
      • Largest size: 15.75 x 13.5 inches/400 x 340mm
    • Board shape:
      • Rectangular
      • Round
      • Slots
      • Cutouts
      • Complex
      • Irregular
    • Board type:
      • Rigid
      • Flexible
      • Rigid-flexible
    • Solder type:
      • Leaded and lead-free
      • Water soluble solder paste
      • Manual soldering for special parts, such as wires and temperature sensitive parts
    • Design file format:
      • Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
      • BOM (bill of materials)
      • Pick and place file (XYRS)

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

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