Shanghai Tankii Alloy Material Co.,Ltd
                                                                                                           
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45 Years
Since 1981
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Porous Copper Foam Metal Sheet 0.3-100mm Thickness 960mm Width for Heat Dissipation and EMI Shielding

Price Negotiable
Price: USD+12.5-19.5+ per m2
MOQ: 100 Square meters
Delivery Time: 7-10days
Brand: TANKII
Product Description
Copper Foam Metal Sheet Technical Specifications
High-performance porous copper foam material with thickness range from 0.3mm to 100mm and maximum width of 960mm, designed for advanced thermal management and electromagnetic applications.
Product Specifications
Parameter Specification
Thickness 0.3mm - 45mm (±0.5mm)
PPI (Pores Per Inch) 5 - 120
Hole Size 0.1mm - 10mm
Surface Density 280 - 9800 g/m² (±30 g/m²)
Bulk Density 0.1 - 0.8 g/cm³
Tensile Strength (Vertical) ≥130 N/cm²
Tensile Strength (Horizontal) ≥100 N/cm²
Elongation (Vertical) ≥5%
Elongation (Horizontal) ≥12%
Porosity 50% - 98%
Width 0 - 960mm (±0.5mm)
Ratio Resistance ≤5×10⁻⁶
Key Features & Benefits
  • Excellent mechanical properties and superior processability for various manufacturing applications
  • Exceptional electrical and thermal conductivity for efficient heat dissipation
  • Massive three-dimensional network structure providing optimal porosity and surface area
  • Superior base and corrosion resistance for long-term durability
  • Outstanding electromagnetic shielding capability for electronic protection
Applications
Ideal for heat dissipation systems, lithium-ion battery components, electromagnetic shielding, and industrial filtration applications. Custom specifications available to meet specific project requirements.
Copper foam metal sheet showing porous structure and material texture for heat dissipation applications
Custom manufacturing available - contact us with your specific thickness, PPI, and dimensional requirements.
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Company Shanghai Tankii Alloy Material Co.,Ltd
Location 1900 Mudanjiang Road, Baoshan District, 201999, Shanghai, China
Contact Person Martin Lee

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