0.95 W/mK high performance ZIITEK thermal conductive PCM phase change materials For IGBTs

TIC800P series is  low melting point thermal interface material. At 50℃, TIC800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC800P series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

TIC800P-Series-Datasheet.pdf

Applications Include:

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Features:

>  Lowest Thermal Resistance
>  0.014℃-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required

Standard Thicknesses:0.005"(0.127mm) 

Standard Sizes:

10" x 16"(254mm x 406mm)       16" X 400'   (406mm X 121.92M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
 
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.