KLM8G1GESD-B03Q 8GB eMMC 5.0 Memory Chip with HS400 Interface and BGA153 Package for Industrial Applications
Price:
Negotiation
MOQ:
1 package
Delivery Time:
3-5 work days
Product Description
KLM8G1GESD-B03Q 8GB eMMC 5.0 Memory Chip
Technical Specifications
| Parameter | Specification |
|---|---|
| Model Number | KLM8G1GESD-B03Q |
| Memory Version | eMMC 5.0 |
| Storage Capacity | 8GB |
| Operating Voltage | 1.8V / 3.3V |
| Interface Standard | HS400 |
| Operating Temperature | -40°C to 105°C |
| Package Type | BGA153 |
| Physical Dimensions | 11.5 x 13 x 0.8 cm |
Key Features
- High-speed HS400 interface for superior data transfer performance
- Wide temperature range (-40°C to 105°C) for industrial applications
- Dual voltage support (1.8V/3.3V) for flexible system integration
- Compact BGA153 package with dimensions of 11.5 x 13 x 0.8 cm
- Industrial-grade reliability for demanding environments
Product Documentation
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol