TIF180-02F Series 2.3 g/cc Silicon Thermal Pad 0.02-0.2mm Thickness with 1.5W/mK Conductivity
The TIF180-02F Series silicon thermal pad features a density of 2.3 g/cc and thickness options from 0.02mm to 0.2mm, designed specifically for handheld portable electronics and other thermal management applications.
- Thermal conductivity: 1.5W/mK
- RoHS compliant and UL recognized
- Fiberglass reinforced for enhanced durability
- Electrically isolating properties
- Easy release construction
- Continuous use temperature: -40°C to 160°C
- Fire rating: 94 V0 equivalent
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
- Semiconductor automated test equipment
- CPU, display cards, and motherboards
| Property | Value | Test Method |
|---|---|---|
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Thickness Range | 0.020"-0.200" | ASTM C351 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Volume Resistivity | 1.0×10¹² Ohm-meter | ASTM D257 |
| Thermal Conductivity | 1.5W/m-K | ASTM D5470 |
Available in 0.010" (0.25mm) to 0.200" (5.08mm) in 0.010" increments
Standard sheet size: 8" × 16" (203mm × 406mm)
Custom thicknesses, die-cut shapes, and pressure-sensitive adhesive options available upon request
Ziitek Electronic Material and Technology Ltd. maintains strict quality control standards with comprehensive thermal engineering expertise. We offer competitive thermal interface materials with flexible production capabilities and confidentiality agreements.
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