Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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PPE Black ESD JEDEC IC Tray 322.6x135.9mm for LGA Chip Package with 150°C Temperature Resistance

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

High-quality JEDEC standard IC tray specifically designed for LGA chip package types, featuring excellent ESD protection and high-temperature resistance up to 150°C.

Technical Specifications
Parameter Specification
Outline Dimensions 322.6 × 135.9 × 8.5 mm
Model Number HN 21062
Package Type LGA
Cavity Size 28.2 × 28.2 × 3.35 mm
Matrix Quantity 3 × 9 = 27 PCS
Material PPE (Polyphenylene Ether)
Color Black
Flatness MAX 0.76 mm
Surface Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Certification ROHS Compliant
Key Features
  • High temperature resistance: Bake 125°C to maximum 150°C
  • Excellent ESD protection with surface resistance range
  • JEDEC standard dimensions: 322.6 × 135.9 mm
  • 45-degree chamfer design for easy equipment identification
  • Minimal warpage control for maximum component protection
  • Compatible with various chip packages including BGA, CSP, QFP, QFN
Applications
  • Integrated circuit packaging
  • PCBA module component handling
  • Electronic component packaging
  • Optical device packaging
Material Temperature Resistance Reference
Material Bake Temperature Surface Resistance
PPE 125°C - Max 150°C 1.0×10⁴Ω - 1.0×10¹¹Ω
MPPO + Carbon Fiber 125°C - Max 150°C 1.0×10⁴Ω - 1.0×10¹¹Ω
MPPO + Carbon Powder 125°C - Max 150°C 1.0×10⁴Ω - 1.0×10¹¹Ω
MPPO + Glass Fiber 125°C - Max 150°C 1.0×10⁴Ω - 1.0×10¹¹Ω
PEI + Carbon Fiber Max 180°C 1.0×10⁴Ω - 1.0×10¹¹Ω
IDP Color 85°C 1.0×10⁶Ω - 1.0×10¹⁰Ω

Custom color, temperature, and other special requirements available upon request.

Product Images
PPE Black ESD JEDEC IC Tray for LGA Chip Package showing dimensions and cavity layout Close-up view of JEDEC IC Tray cavities and 45-degree chamfer design for automated equipment
Customization Services

We provide comprehensive OEM and ODM services including:

  • Custom IC tray design based on your component specifications
  • One-stop service from design to packaging and shipping
  • Strict quality control ensuring 100% qualified rate
  • International JEDEC standards compliance

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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