380V Three Phase LDI Laser Direct Imaging Equipment 0.05mm-3.5mm Panel Thickness 30μm Resolution
Price:
negotiable price
MOQ:
1 set
Delivery Time:
20 work days
Brand:
GIS
Product Description
380V Three Phase LDI Laser Direct Imaging Equipment
Advanced PCB manufacturing solution with 0.05mm-3.5mm panel thickness capability and 30μm resolution for high-density interconnect applications.
Laser Direct Imaging Technology Overview
Our LDI system replaces traditional photo tooling by directly exposing circuit traces with a computer-controlled laser beam, enabling digital creation of PCB images with superior precision and efficiency.
Key System Features
- Compatible with existing PCB production processes and dry film materials
- Traceability functions for quality control and process monitoring
- Capability to expose each layer of solder resist film
- Designed for batch production requirements and mass manufacturing
- Digital imaging eliminates phototool costs and maintenance
Technical Specifications
| Specification | Details |
|---|---|
| Model | DPX420TFA |
| Applications | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 30μm |
| Capacity | 30-40 seconds @ 18"×24" |
| Exposure Size | 610×710mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% ~ -10% |
| Operating Environment | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above |
Alignment & Deviation Control
Advanced deviation control modes including fixed increase and contraction, automatic increase and contraction, interval increase and contraction, and partition alignment for precise registration.
Environmental Requirements
Equipment must be installed in controlled environments free from violent vibration to maintain optimal performance and alignment accuracy.
About Our Solutions
We provide innovative PCB laser direct imaging system solutions ranging from configurations for high-mix and emerging PCB niche applications to fully automated LDI systems for mass production environments.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Jiangsu GIS Laser Technologies Inc.,
Location
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Contact Person
Tian