ISO 9001 CE Certified 260mm x 800mm LDI System for Roll-to-Roll PCB, HDI, and FPC Applications with 15μm Resolution
Our advanced Laser Direct Imaging (LDI) system eliminates the need for traditional phototools by using computer-controlled laser beams to digitally create circuit patterns directly onto PCB substrates. This innovative approach delivers superior precision and efficiency for modern PCB fabrication.
The system positions a photo-sensitive PCB substrate under a computer-controlled laser. The computer scans the board surface, matches it to pre-loaded CAD/CAM design files, and uses the laser to directly create the required circuit patterns with exceptional accuracy.
| Specification | Details |
|---|---|
| Application | PCB, HDI, FPC (inner layer, outer layer, anti-welding) |
| Resolution (Mass Production) | 15μm |
| Capacity | 12S@18"×24" |
| Exposure Size | 260×800mm |
| Panel Thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment Capability | Outer layer ±12μm; Inner layer ±24μm |
| Line Width Tolerance | ±10% |
| Laser Type | LD Laser, 405±5nm |
| File Format | Gerber 274X; ODB++ |
| Power Requirements | 380V three-phase AC, 6.4kW, 50Hz, voltage fluctuation range +7% ~ -10% |
- Yellow light room environment
- Temperature: 22°C ± 1°C
- Humidity: 50% ± 5%
- Cleanliness level: 10000 and above
- Vibration: Avoid violent vibration near equipment
- Fixed increase and contraction mode
- Automatic increase and contraction mode
- Interval increase and contraction mode
- Partition alignment capability
We are an innovative supplier of comprehensive PCB laser direct imaging (LDI) system solutions. Our product portfolio ranges from LDI configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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