High precision quartz crystal resonator CHANGXING ELECTRONICS 8DSC200G0012L for wireless communication devices

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Product Description

Product Overview

The Seam3225 is a high-precision Quartz Crystal Resonator from CHANGXING ELECTRONICS CO.,LTD., designed for applications requiring high frequency stability and excellent EMI reduction. This SMD Seam Sealing Crystal, part of the 8D Series, is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. It is RoHS Compliant and Pb Free.

Product Attributes

Brand: CHANGXING ELECTRONICS CO.,LTD.
Product Model: Seam3225 4PIN
Series: 8D Series
Crystal Type: AT CUT (thickness shear mode)
Sealing Type: Seam Sealing
Compliance: RoHS Compliant / Pb Free

Technical Specifications

Parameter	Value	Units	Notes
Nominal Frequency	20.000000	MHz
Load Capacitance	12	pF
Frequency Tolerance (at 25 3)	10	ppm
Frequency Tolerance (Standard)	30	ppm
Operating Temperature Range	-40+85
Storage Temperature Range	-55+125
Aging (1st Year)	3	ppm
Drive Level	100	uW	Max.
Shunt Capacitance (C0)	5	pF	Max.
Effective Resistance (Rr)	40		Max.
Insulation Resistance	500	M	Min. at DC 100V
Pulling Sensitivity (TS)	125	ppm/pF
Spurious Response	-3.0	dB
Over Operating Temp. Range	-1000+5000	ppm
Dimensions (L x W x H)	3.2 x 2.5 x 0.7	mm
Reel Quantity	3,000	pcs per reel	(WHITE)
Product Weight	17.322	mg

Dimensions

Dimension	Value	Unit
A	1.40	0.1 mm
B	3.40	0.1 mm
C	2.70	0.1 mm
D	4.00	0.1 mm
E	8.0	0.2 mm
F	4.00	0.11 mm
G	1.55	0.05 mm
H	1.75	0.1 mm
L	178	1.0 mm
L1	13	0.5 mm
W	11.5	0.2 mm
W1	8.0	+1.0 mm

Marking

LOGO, MHz, , ,

Reflow Condition

Refer to document CX20.0 ****

Packing

(EIA-481-2)

Reliability Specifications

1. Mechanical Endurance

Vibration: 10 2000 Hz, Amplitude 1.52 mm/20G, Sweep time 20 minute (JIS C6701)
Drop Test: 150 cm height, 3 times on concrete floor (IEC-68-02-27)
Mechanical Shock: Half sine wave (1000 G), 0.5 m sec. duration time, three mutually perpendicular axes each 3 times (MIL-STD-202F)
Resistance To Soldering Heat: Pre-heat time 60 120 sec., Pre-heat temperature 125 , Test temperature 260 5 , Test time 10 1 sec. (MIL-STD-883E)
Solderability: Flux Rosin resin methyl alcohol solvent (1:4), Immersion time 5 1 seconds (JIS C6701)

2. Environmental Endurance

High Temp & Humidity: 85 3, RH 85%, 500Hrs (JIS C5023)
Low Temp. Storage: -40 3 for 500 12 hours (MIL-STD-883E)
Thermal Shock: Total 100 cycles of temperature cycle +125 3 for 500 12 hours (MIL-STD-883E)
Pressure Cooker Storage: 125 3, RH 100%, 2 bar, 240Hrs (MIL-STD-883E)
High Temp. Storage: 125 (Total test time 12 hours)
Helium Bombing: 4.5 Kgf / cm2 for 2 hr (MIL-STD-883E)
Fine Leak: Test Pressure: 2Kg / cm2 (Standard Sample For Automatic Gross Leak Detector)
Gross Leak Test: Test temperature 260 5, Immersing depth 0.5 mm minimum (MIL-STD-883E)
Shock Test: 150g/150cm Height, 3 times in the direction of X, Y, Z on concrete floor (MIL-STD-202F)

Material Composition Declaration

Part Name	Material Name	Constituent Name	CAS No.	Material Analysis (%)
(Wafer)	(Ceramics)	Al2O3 (Aluminum oxide)	1344-28-1	92.40%
		SiO2 (Silicon oxide)	7631-86-9	4.31%
		Cr2o3 (Chromium oxide)	1308-38-9	1.50%
		MgO (Magnesium oxide)	1309-48-4	0.69%
		CaO (Calcium oxide)	1305-78-8	1.10%
(Metalizing)	(Metal)	Fe (Iron)	7439-89-6	40.70%
		Ni (Nickel)	7440-02-0	21.80%
		Co (Cobalt)	7440-48-4	12.80%
		Ag (silver)	7440-22-4	21.00%
		Cu	7440-50-8	3.70%
(Electrode)	(Metal)	W (Tungsten)	7440-33-7	62.50%
		Au (Gold)	7440-57-5	4.61%
		Ni (Nickel)	7440-02-0	32.89%
		Fe (Iron)	7439-89-6	47.71%
(Plating)	Ni (Nickel)	Ni (Nickel)	7440-02-0	26.11%
		Co (Cobalt)	7440-48-4	15.44%
(Plating)	Ni (Plating)	Ni (Nickel)	7440-02-0	10.74%
(Solder)	(Metal)	Ag (Silver)	7440-22-4	75.00%
(Base)	(Ceramics)	SiO2 (Silicon oxide)	14808-60-7	100.00%
(Adhesive)	(Polymer)	(Petroleum solvent)		5.00%
		(Silicone resin)		15.00%
		(Crystalline silica)		5.00%
(Cover)	4J29 (Base Material)	Cr (Chromium)	7440-47-3	5.56%
		Ag (Silver)	7440-22-4	94.44%