Compact SMA Thin Package BLUE ROCKET US2D Ultrafast Recovery Rectifier for Surface Mount Electronics
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Product Description
Product Overview
The US2A~US2M series are surface-mount ultrafast recovery rectifiers designed for general-purpose applications. Featuring a glass-passivated chip junction for high efficiency, these diodes offer reverse voltages ranging from 50V to 1000V and a forward current of 2.0A. They are compliant with EU RoHS 2011/65/EU directives, lead-free, and halogen-free, making them suitable for modern electronic assemblies requiring surface mounting. The compact SMA thin package is ideal for space-constrained designs.
Product Attributes
- Type: Ultrafast Recovery Rectifier
- Package: SMA thin package
- Chip Technology: Glass Passivated Chip Junction
- Compliance: Lead-free, Halogen-free, EU RoHS 2011/65/EU directives
- Application: Surface mounted applications, General purpose
- Brand/Manufacturer: FS (implied by datasheet URL http://www.fsbrec.com)
Technical Specifications
| Parameter | Symbol | Test Condition | US2A | US2B | US2D | US2G | US2J | US2K | US2M | Unit | |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Electrical Characteristics (Ta=25) | |||||||||||
| Maximum Instantaneous Forward Voltage | VF | IF=2.0A | 1.0 | 1.3 | 1.65 | V | |||||
| Maximum DC Reverse Current at Maximum DC Blocking Voltage | IR | Ta=25 | 5.0 | uA | |||||||
| Ta=125 | 100 | uA | |||||||||
| Maximum Reverse Recovery Time | trr | IF=0.5A, IR=1.0A, Irr=0.25A | 50 | 75 | ns | ||||||
| Absolute Maximum Ratings (Ta=25) | |||||||||||
| Maximum Repetitive Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V | ||
| Maximum RMS voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V | ||
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V | ||
| Maximum Average Forward Rectified Current at TC = 125 | IFAV | 2.0 | A | ||||||||
| Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) | IFSM | 50 | A | ||||||||
| Typical Thermal Resistance | RJA | 65 | /W | ||||||||
| RJC | 20 | /W | |||||||||
| Operating and Storage Temperature Range | Tj,Tstg | -55~+150 | |||||||||
| Package Type | Units/Reel | Reels/Inner Box | Units/Inner Box | Inner Boxes/Outer Box | Units/Outer Box | Dimension (Reel) | Dimension (Inner Box) | Dimension (Outer Box) |
|---|---|---|---|---|---|---|---|---|
| SMA | 5000 | 2 | 10000 | 7 | 70000 | 1312 | 336X336X40 | 380X335X366 |
| Test Condition | Temperature | Time |
|---|---|---|
| Resistance to Soldering Heat Test Conditions | 2605 | 101 sec |
| Parameter | Profile Temperature | Profile Duration |
|---|---|---|
| Temperature Profile for IR Reflow Soldering (Pb-Free) - Preheating | 150~180 | 60~90 sec |
| Temperature Profile for IR Reflow Soldering (Pb-Free) - Peak Temperature | 2455 | 50.5 sec |
| Temperature Profile for IR Reflow Soldering (Pb-Free) - Cooling Speed | 2~10/sec |
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