back locking rotary lock connector DIANWEI 8.03A0.035200 designed for 0.2mm thick FFC FPC cables

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Product Description

Product Overview

The DIANWEI 0.3mm FFC/FPC dual contact side connector (H=0.9mm) is a back-locking type connector designed for 0.2mm thick FFC/FPC cables, supporting 9 to 61 pins. It features dual contact for reliable connections and SMT termination. This connector is suitable for applications requiring compact design and robust performance.

Product Attributes

Brand: DIANWEI
Origin: Dongguan, China
Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise
Color: Natural (Housing), Black (Cover)

Technical Specifications

Specification	Details
Series	8.03A
Pitch	0.3mm
Height (H)	0.9mm
Applicable FFC/FPC Thickness	0.2mm 0.02mm
Pin Count	9-61pin
Contact Type	Dual contact, side connector
Locking Mechanism	Back-locking (Rotary lock)
Termination	SMT
Housing Material	LCP (UL 94V-0)
Cover Material	PA/PPS (UL 94V-0)
Terminal Material	Copper Alloy
Stator Material	Copper Alloy
Plating	Gold plating 1~3u" (Contact and solder area)
Coplanarity	0.10mm MAX
Operation Temperature	-40 ~ +85
Operation Humidity	20-85RH
Storage Temperature	-10 ~ +50
Storage Humidity	20 ~ 85%RH
Rating Voltage	30V (AC/DC)
Rating Current	0.2A / PIN (at ambient temperature 20)
Contact Resistance	100m Max
Insulation Resistance	50M MIN
Dielectric Strength	100V AC (1 Minute, between adjacent terminals)
Retention Force (Single Pin)	0.2N / PIN MIN
Retention Force (Stator Pin)	0.3N / PIN MIN
Retention Force (FFC/FPC)	0.2N Min/Pin (PIN count X 0.2N Min)
Shock Resistance	490m/s, 11ms, 3 times per 6 directions
Vibration Resistance	1.52mm Amplitude, 10~55~10Hz Frequency, 2 hours per 3 axes
Durability (Lock/Unlock)	20 times
Heat Resistance	852 for 96H
Humidity Resistance	403, 90~95% RH for 96H
High/Low Temperature Cycle	5 cycles
Salt Spray (Gold Plating)	351, 5% salt water density, 24H
Solderability	Wetting over 90% of dipping area at 2455 for 3sec
Resistance to Soldering Heat	Peak temp 2505, over 225 for 305sec
Recommended Soldering Profile	Pre-heating: 150~180 (60~120s), Peak: 2505, Over 225: 305s (Lock cover must be open during SMT)