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| Categories | Magnetic RJ45 Jack |
|---|---|
| Brand Name: | LINK-PP |
| Model Number: | ARJM11B3-809-KB-CW2 |
| Certification: | UL,ROHS,Reach,ISO |
| Place of Origin: | GuangDong, China |
| MOQ: | 50/500/1000 |
| Price: | Supportive |
| Payment Terms: | TT,NET30/60/90 Days |
| Supply Ability: | 3000000/Month |
| Delivery Time: | Stock |
| Packaging Details: | 50/ tray,24tray in 1 carton, which is 37*30*30 cm, 9KGS (1200 pcs) / carton |
| Model: | ARJM11B3-809-KB-CW2 |
| Manufacturer PN: | LPJxxxxxxxNL Series |
| Interface: | 2.5G Mbps |
| Termination: | Solder |
| LEDs: | Optional |
| Samples: | Free |
| Company Info. |
| LINK-PP INT'L TECHNOLOGY CO., LIMITED |
| Verified Supplier |
| View Contact Details |
| Product List |
| Packaging | Tray | |
|---|---|---|
| Part Status | Active | |
| Connector Type | RJ45 | |
| Number of Ports | 1 | |
| Number of Rows | 1 | |
| Applications | 2.5G Base-T, AutoMDIX | |
| Mounting Type | Through Hole | |
| Orientation | 90° Angle (Right) | |
| Termination | Solder | |
| Height Above Board | 0.543" (13.80mm) | |
| LED Color | Does Not Contain LED | |
| Number of Cores per Jack | 8 | |
| Shielding | Shielded | |
| Features | Board Lock | |
| Tab Direction | Up | |
| Contact Material | - | |
| Contact Finish | Gold | |
| Operating Temperature | -40°C ~ 85°C | |
| Contact Finish Thickness | 30.0µin (0.76µm) | |
| Shield Material | - | |
| Dielectric Material | - |
Designed to support applications, such as ADSL modems, LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...
Competitive Advantage
19 years production experience,
2600 staff,
100% test
Flexible delivery time
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly
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