8 Layer HASL Process Rigid Flex PCB :
An 8-layer HASL (Hot Air Solder Leveling) Rigid-Flex PCB is an advanced hybrid circuit board integrating eight conductive
layers within a unified structure of rigid and flexible polyimide
substrates. It leverages rigid sections for component mounting and
complex circuitry, interconnected by dynamic flexible layers that
enable 3D folding and bending. The HASL surface finish—applied by
coating exposed copper with molten tin-lead or lead-free alloy
followed by hot air leveling—provides cost-effective solderability,
oxidation resistance, and robust shelf life. This architecture
delivers ultra-high density (enabling complex HDI designs),
exceptional mechanical resilience under repeated stress,
space/weight savings exceeding 50% versus traditional rigid boards
with connectors, and enhanced signal integrity in high-frequency
applications.
Features:
| High Density | The multilayer design allows for high component density, making it
suitable for complex electronic systems. |
| Reliability | The combination of rigid and flexible sections enhances durability
and reliability, especially in dynamic environments. |
| Thermal Management | Multiple layers can be designed to improve heat dissipation and
manage thermal performance. |
| Solderability | The tin-spray finish ensures good solderability and protects the
copper traces from oxidation. |
Support and Services:
Our team of experts is dedicated to providing comprehensive technical support and services for our Rigid Flex PCB product. Whether you have questions about
design specifications, manufacturing processes, or troubleshooting
issues, we are here to assist you every step of the way. Our goal
is to ensure that your Rigid Flex PCBs meet your expectations and
requirements, delivering high-quality performance for your
applications.
Difficulties in making rigid-flex PCBs
1.Flexible Section Challenges Material fragility: Thin, flexible substrates require specialized handling (e.g.,
carrier boards for horizontal processing) to prevent damage or
misalignment .
2.Chemical sensitivity: Polyimide materials are incompatible with strong alkalis,
necessitating adjusted process parameters for desmearing and
blackening .
3.Lamination stability: Flexible layers exhibit poor dimensional stability, requiring
controlled lamination conditions and specialized padding materials
(e.g.,polypropylene films) to ensure adhesion .
4. Rigid Section Challenges Stress management: Inconsistent glass fabric orientation and thermal stress during
pressing can cause warping or delamination .
5.Dimensional control:Shrinkage/expansion variations in flexible materials demand
pre-compensation in rigid section fabrication .
6.Via processing: Flexible layer window machining requires precise timing and
parameter control to balance weld integrity and foldability .
7.Integration Challenges Layer alignment: Hybrid FPC/PCB production necessitates precise registration
between flexible and rigid layers, often using OPE- punched tooling
.
8.Quality control: High-value assemblies require 100% inspection due to complex
process flows and low yield rates .
9.Process integration: Conflicting requirements between flexible (e.g., NOFLOW prepregs)
and rigid (e.g., standard FR-4) materials complicate lamination and
drilling .
White Oil 4 Layer Sinking Gold Rigid Flex PCB Board Stable Performance Customized
