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CVD Diamond Heat Sink Chips Boost Heat Dissipation In Advanced Packaging.

Others
2025-09-15
Unpolished Rough Diamond Flawless Lab Created Diamonds Diamond Heat Sink
Discover how Single Crystal CVD Diamond Substrate chips enhance heat dissipation in advanced packaging. Available in sizes 7x7, 8x8, 9x9, and 10x10mm, these lab-grown diamond seeds offer superior thermal conductivity of 1500W/MK for high-power electronic components.