High Precision IC Bonder 8-12 Inch Wafers

Observe the step-by-step operation and see practical examples of usage in this video showcasing the High Precision IC Bonding Machine WBD2200 PLUS. You will see a detailed demonstration of its automatic nozzle change, high-precision placement for 8-12 inch wafers, and its application in SIP packaging, Memory Stack Die, and MEMS processes. Learn how its visual recognition and real-time compensation systems ensure stable mounting accuracy for automotive and medical electronics.