The Liquid Cold Plate is the core heat exchange component of the liquid cooling system. Through the metal substrate and internal sealed flow channel, the heat from the heating device is efficiently transferred to the circulating cooling liquid, and then dispersed to the outside world through the heat exchanger. The heat dissipation efficiency is much higher than traditional air cooling and is widely used in high power density scenarios.
basic structure and principle
Core components: bottom plate (aluminum/copper, directly attached to the heat source), internal flow channel (serpentine/parallel/microchannel), cover plate (sealed flow channel), and liquid inlet and outlet joints; commonly used cooling liquids are deionized water, water-glycol mixture.
Work flow: heat source → metal bottom plate heat conduction → flow channel wall → flowing coolant absorbs heat → coolant flows to CDU /radiator to dissipate heat → cooling back to cold plate after cooling, forming a closed loop.
Key advantages: low thermal resistance (0.02 - 0.05°C/W), high heat dissipation power, good temperature uniformity, and low noise; suitable for data centers with stand-alone cabinet power of 50kW +, AI chips, new energy vehicle battery packs, etc.