X-Ray Solution YS-X5600,Microfocus X-Ray Inspection System Manufacturer

Price Negotiable

Price: USD31940

MOQ: 1

Delivery Time: 20work days

Brand: YUSH

Product Description

1.Application:

1: Semiconductor	2: Automotiveelectronics	3: PCB’A	4: LED
5: BGA/QFN inspection	6: Aluminum die casting	7: Mould	8: Electrical and mechanical components
9: Biological agriculture seed	10: Aviation component	11: Wheel hub	12: Wire/USB/Plug

2.Functions and Features:

Function	Advantages
X-ray detector can move along Z direction, Speed of table moving along X-Y direction can be adjusted.	Larger effective detection range, improving the magnification and the detection efficiency of the product.
Long life X-ray tube, maintenance free for life	Adopt the world's top Japanese Hamamatsu X-ray source
Fault less than 2.5μm can be detected. High detection repeat accuracy.	Easy to distinguish the gold wire bending and break of the semiconductor package.
Powerful CNC Measuring Function, can inspect automatically, testing program can be edited.	Suitable for large-scale inspection and improve detection efficiency.
Small body, easy to place, less space	Can be used in laboratories, materials rooms, etc.
Large navigation view, table will move to where you click the mouse.	Very easy to operate, quickly find item defects and improve detection efficiency

3.Application Advantage:

Miniaturized equipment, easy to install and operate
Applicable to Chip, BGA/CSP, Wafer, SOP/QFN, SMT and PTU packaging, Sensors and other fields products inspection.
High resolution design to get the best image in a very short time.
Infrared automatic navigation and positioning function can select the shooting location quickly.
CNC inspection mode which can quickly and automatically inspect multi-point array.
Inclined multi-angle inspection makes it easier to inspect sample defects.
Simple softwareoperation, low operating costs
Long lifespan

4.Automatic Void Ratio Calculation

Enhanced BGA inspection function

YS-X5600 can quickly select and mark a single solder ball, or select the solder balls to be inspected by matrix box ; it can manually or automatically identify BGA solder balls and complete the inspection. Follow the system guidelines to easily complete the inspection process and ensure accurate and reliable inspection results.

5.X-Ray Working Principle

6.CNC Programming

Simply click the mouse and you can write programs.
Object table moves along X, Y direction for positioning; X-ray tube move along Z direction for positioning.
Voltage and current set by software.
Image settings: brightness, contrast, auto gain and exposure
Users can change the pause time for program conversion.
Anti-collision system can maximize the tilt and observation of the workpieces.
Automatic analysis on diameter, proportion of cavity, area and roundness of BGA.