5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity
Price:
Negotiation
MOQ:
200 kg
Delivery Time:
5-8 days
Brand:
HUITIAN
Product Description
5280 Two-Part 1:1 Gray Silicone Potting Compound For Electronics
High-performance potting compound designed for module power supply, LED drive power supply, network transformer, reversing radar, and other electronic applications. Provides moistureproof, anti-corrosion, and shock-proof protection.
Product Attributes
| Attribute | Value |
|---|---|
| Physical Form | Paste |
| Color Part A | Gray fluid |
| Color Part B | White fluid |
| Viscosity Part A | 2,000~3,500 mPa·s |
| Viscosity Part B | 2,000~3,500 mPa·s |
| Mixing Ratio | 1:1 |
| Operating Time @25 °C | 60-240 mins |
| Curing Time @80℃ | ≤30 mins |
| Hardness | 10~30 Shore A |
| Volume resistivity | 1.0*10^12 Ω∙cm |
| Dielectric strength | ≥14 KV/mm |
| Thermal Conductivity | ≥0.6 W/(m•K) |
Product Description
5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.
Product Applications
- Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
- LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
- Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
- Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
- General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.
Key Product Features
- High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m*K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
- UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
- Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
- Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
- RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive.
- Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.
Technical Parameters
| Physical Properties Before Curing (25 ±2℃, 60%±5%RH) | |
|---|---|
| Appearance (A) | Gray flow |
| Appearance (B) | White flow |
| Viscosity (A) | 2,000~3,500 mPa*s |
| Viscosity (B) | 2,000~3,500 mPa*s |
| Curing Properties (A:B=1:1) | |
| Operating Time (25℃) | 60~240 min |
| Curing Time (85℃) | ≤30 min |
| Physical Properties After Curing (25 ±2℃, 60±5%RH, A:B=1:1) | |
| Density | 1.70~1.9 g/cm³ |
| Hardness | 10~30 Shore A |
| Shear Strength (PCB) | 0.3-0.8 MPa |
| Thermal Conductivity | ≥0.6 W/m*K |
| Dielectric Strength | ≥14 KV/mm |
| Volume Resistivity | ≥1.0*10¹² Ω*cm |
Directions for Use
Preparation
- Stirring: Fully stir part A and part B separately, either manually or mechanically, to ensure homogeneity and avoid performance changes due to filler settlement.
Mixing
- Weighing: Accurately weigh the two parts into a clean container by weight ratio (1:1) and stir well to ensure thorough mixing.
Defoaming
- Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
- Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.
Potting
- Surface Preparation: Ensure the surfaces to be potted are clean and dry. Apply the glue while it still has good flowability to achieve optimal leveling.
Curing
- Curing Conditions: The glue can cure at room temperature or by heating. Higher temperatures accelerate curing, and heat curing is recommended in colder conditions (e.g., winter).
Packaging & Storage Conditions
Packaging
- 5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)
Storage
Store at room temperature in a cool and dry place. The shelf life is 6 months.
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Get in Touch
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Company
Shanghai Huitian New Material Co., Ltd
Location
No. 251, Wenji Road, Songjiang District, Shanghai China
Contact Person
Simon Dou