No Clean Solder Paste with 25-45μm Particle Size for BGA Welding - 500g Lead Silver Composition
Price:
Negotiation
MOQ:
1pcs
Delivery Time:
1-7Day
Brand:
PY
Product Description
No Clean Solder Paste with Lead Silver Composition
Professional leaded silver solder paste specifically formulated for BGA welding applications with 25-45μm particle size, supplied in 500g containers.
Product Specifications
| Attribute | Specification |
|---|---|
| Color | Silver Gray |
| Net Weight | 500g |
| Particle Size | 25-45μm |
| Shelf Life | 6 months |
Key Features
- Primary materials: Tin (Sn), Lead (Pb), Silver (Ag)
- High-quality tin solder paste formulation
- Suitable for radio, communication, meters and instruments
- Easy residue removal with hot air after soldering
- Available in multiple alloy compositions
- Paste form for easy application
- Flux types: no-clean, rosin, and water-soluble liquid
Chemical Composition (Sn63-Pb37)
| Element | Composition (wt.%) |
|---|---|
| Tin (Sn) | 62.6±0.5 |
| Lead (Pb) | 37±0.5 |
| Silver (Ag) | 0.4 |
| Antimony (Sb) | <0.20 |
| Copper (Cu) | 0.08 |
| Bismuth (Bi) | <0.1 |
| Zinc (Zn) | 0.03 |
| Iron (Fe) | <0.02 |
| Aluminum (Al) | <0.005 |
| Cadmium (Cd) | <0.002 |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ping You Industrial Co.,Ltd
Location
West of 2nd Floor, Building 10, Zhengzhong Science Park, Xintian Community, Fuhai Street, Bao'an District, Shenzhen China 518103
Contact Person
Becky Lee