Multilayer Sided Printed Circuit Boards , Rigid Flex Circuit pcba Board Standard FR-4，Electronic Printed Circuit Board
Multilayer Sided Printed Circuit Boards , Rigid Flex Circuit pcba Board Standard FR-4,Electronic Printed Circuit Board
Bried description
Our PCB technology capacity includes 1 to 50 layers, minimum dill hole size of 0.1mm, minimum track/line size of 0.075mm, surface treatment of OSP, HAL, HASL, ENIG, Gold Finger and more. We can make our production capacity of 10,000-20,000 square meters/month for double sides and 8,000-12,000square meters/month for multilayer.
We have over 300 employees and 8,000 square meters building area. Our products include Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df, FPC, Rigid-Flex PCB and Aluminum, Copper base PCB, etc. Assembly service including SMT, DIP with six assembly lines.
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Detailed specification
| Layer count | Single sided, double sided and multilayer to 50 layers. |
| Base material | FR-4, High Tg FR-4, Aluminum Base, Copper Base, CEM-1, CEM-3 and so on |
| Board thickness | 0.6-3mm or thinner |
| Copper thickness | 0.5-6oz or thicker |
| surface treatment | HASL, Immersion Gold(ENIG), Immersion Silver, Immersion Tin, Plating Gold and Gold finger. |
| Soldmask | Green, Blue, Black, Matte Green , White and Red |
| Silkscreen | Black and white |
What KAZ Circuit can do for you:
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Electronic printed circuit board (PCB) manufacturing processes:
PCB material choice:
Common base materials include FR-4 (fiberglass), polyimide and ceramics
Consider properties such as dielectric constant, thermal performance, and flexibility
Special materials available for high-frequency, high-power or flexible PCBs
Copper thickness and layer count:
Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)
Single-sided, double-sided and multilayer PCBs available
Additional copper layers improve power distribution, heat dissipation and signal integrity
Surface Treatment:
HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat
ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance
Immersion Silver - Cost effective for lead-free soldering
Additional options include ENEPIG, OSP and direct gold plating
Advanced PCB Technologies:
Blind and Buried Vias for High Density Interconnects
Microvia Technology for Ultra-Fine Pitch and Miniaturization
Rigid-flex PCBs for applications that require flexibility
High frequencies and high speeds with controlled impedance pc
PCB manufacturing technology:
Subtractive process (most common) - etching away unwanted copper
Additive process - creating copper traces on the base material
Semi-additive process - combining subtractive and additive technologies
Design for Manufacturer (DFM):
Adherence to PCB design guidelines for reliable manufacturing
Considerations include trace width/spacing, via size and component location
Close collaboration between designers and manufacturers is essential
QA and testing:
Electrical testing (e.g., online testing, functional testing)
Mechanical testing (e.g., bending, shock, vibration)
Environmental testing (e.g., temperature, humidity, thermal cycles)
More photos
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.