The  PVD Direct Plating  Silver on ceramic dielectric filters is an advanced coating technology applied with 5G base station and other semiconductors for  electronic industries. One typical application is Ceramic Radiating Substrate. Silver / Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods: DBC LTCC HTCC, which has much lower production costs. Royal Technology’s team collaborated with our customer to develop the PVD Silver Plating process successfully applying  with  sputtering technology which can replace conventional liquid silver brushing process. 

Typical Applications  

• HBLED
• Substrates for solar concentrator cells
• Power semiconductor packaging including automotive motor control
• Hybrid and electric automobile power management electronics
• Packages for RF
• Microwave devices
• Ceramic dielectric filters for 5G Base station

Only to name a few, for more applications, please contact Royal Tech.

Technical Advantages

Large Capacity
Flexible Modules Design
Precised Manufacturing

The  RTAS1215 batch  Sputtering system is the upgraded version ,the newest system has several advantages:

Higher Efficient Process
1. Double sided coating is available by turnover fixture design
2. Up to 8 standard planar cathode flanges for multiple sources
3. Large capacity up to 2.2 ㎡ ceramic chips per cycle
4. Fully Automation, PLC+Touch Screen, ONE-touch control system

Lower Production Cost
1. Equipped with 2 sets magnetic suspension molecular pumps, fast starting time, free maintenance
2. Maximum heating power
3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings

Technical Specifications

Model: RTSP1200-DPC

Chamber Height (mm): 1500

Chamber diameter (mm): φ1200

Sputtering Cathodes Mounting Flange: 4

Ion Source Mounting Flange: 1

Arc Cathodes Mounting Flange: 8

Satellites (mm): 16 x Φ150

Pulsed Bias Power (KW): 36

Sputtering Power (KW): DC36 + MF36

Arc Power(KW): 8 x 5

Ion Source Power (KW): 5

Heating Power (KW): 36

Effective Coating Height (mm): 1020

Magnetic Suspension Molecular Pump: 2 x 3300 L/S

Roots Pump: 1 x 1000m³/h

Rotary Vane Pump: 1 x 300m³/h

Holding Pump: 1 x 60m³/h

Capacity: 2.2 ㎡

Installation Area ( L x W x H) mm: 4200*6000*3500

Insite

Built Time: Since 2016

Quantity: 3 sets

Location:  China

Compared with the market huge demand, batch system's productivity is low; we have been dedicated developing the In-line sputtering system ( continues sputtering deposition line) with automatically robot loading/unloading devices.  Anyone who is interested in this system, please contact our technician for more specifications.