H9TQ26ADFTACUR-KUM EMCP Memory Chip 32GB NAND + 24GB LPDDR3 FBGA221 5V Industrial Temperature
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
H9TQ26ADFTACUR-KUM EMCP Memory Chip - Advanced 32GB NAND + 24GB LPDDR3 embedded multi-chip package designed for industrial applications requiring reliable high-density storage and memory solutions.
Product Specifications
| Parameter | Specification |
|---|---|
| Part Number | H9TQ26ADFTACUR-KUM |
| Memory Configuration | 32GB NAND Flash + 24GB LPDDR3 |
| Package Type | FBGA221 |
| Operating Voltage | 5V |
| Operating Temperature | 1°C to 100°C |
| Product Grade | Industrial Temperature (IT) |
| Product Status | Mass Production |
Key Features
- Embedded Multi-Chip Package (eMCP) combining NAND flash and LPDDR3 memory
- High-density 32GB NAND + 24GB LPDDR3 configuration for demanding applications
- FBGA221 package optimized for space-constrained embedded systems
- Industrial temperature range (1°C to 100°C) for harsh environments
- 5V operating voltage compatible with industrial power systems
- Currently in mass production for reliable supply chain availability
Applications
- Industrial automation and control systems
- Embedded computing platforms
- Telecommunications equipment
- Medical devices and instrumentation
- Automotive electronics and infotainment systems
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol