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Intel Core i7-5600U Mobile Processor 2.6GHz up to 3.2GHz 15W TDP BGA1168 Socket

Price Negotiable
Price: Negotiation
MOQ: 1 piece
Delivery Time: 3-5 work days
Product Description
Intel Core i7-5600U Mobile Processor Overview

The Intel Core i7-5600U is an ultra low voltage (ULV) dual-core processor built on the advanced Broadwell architecture. This mobile CPU delivers exceptional performance with power efficiency, featuring 2.6 GHz base frequency that turbo boosts up to 3.2 GHz.

Key Specifications
ParameterSpecification
Processor Modeli7-5600U (SR23V)
Core Configuration2 Cores, 4 Threads
Base Frequency2.6 GHz
Max Turbo Frequency3.2 GHz (2 cores)
L3 Cache4 MB
Thermal Design Power15 W
Manufacturing Process14 nm
Socket TypeBGA1168
Technical Architecture
Core Architecture

Based on the Broadwell microarchitecture with F0 core stepping (SR23V), this processor features 1.38 billion transistors on an 82mm² die. The 14nm manufacturing process with FinFET transistors enables superior power efficiency and performance.

Cache Hierarchy
Cache LevelSizeConfiguration
L1 Cache2 x 32 KB8-way set associative instruction and data caches
L2 Cache2 x 256 KB8-way set associative caches
L3 Cache4 MB16-way set associative shared cache
Memory & Graphics
Memory Controller

Integrated dual-channel memory controller supporting DDR3L-1333, DDR3L-1600, LPDDR3-1333, and LPDDR3-1600 memory types with maximum bandwidth of 25.6 GB/s and support for up to 16 GB physical memory.

Integrated Graphics
FeatureSpecification
GPU TypeIntel HD Graphics 5500 (GT2)
Base Frequency300 MHz
Maximum Frequency950 MHz
Execution Units24
Supported Displays3
Advanced Technologies
  • Hyper-Threading Technology for improved multitasking
  • Turbo Boost 2.0 for dynamic performance optimization
  • Virtualization Technology (VT-x, VT-d)
  • Enhanced SpeedStep Technology for power management
  • Advanced Vector Extensions (AVX, AVX2)
  • Transactional Synchronization Extensions (TSX)
  • Trusted Execution Technology (TXT)
  • AES Encryption Instructions
  • Execute Disable Bit for enhanced security
Thermal & Electrical Specifications
ParameterValue
Thermal Design Power (TDP)15 W
Maximum Operating Temperature105°C
Bus Speed5 GT/s DMI
Clock Multiplier26
Package Information

1168-ball micro-FCBGA package measuring 1.57" x 0.94" (4cm x 2.4cm) with BGA1168 socket compatibility. Officially launched on January 5, 2015.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person Carol

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