Intel NH82801EB SL7YC Mobile Chipset BGA Package 31mm x 31mm with 8 USB 2.0 Ports and 110°C Thermal Rating
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
Product Overview
BGA Package Intel NH82801EB SL7YC mobile chipset combining Northbridge and Southbridge functionality in a compact 31mm x 31mm form factor. This integrated solution provides comprehensive system control for mobile computing applications.
Key Specifications
| Package Type | BGA (Ball Grid Array) |
| Package Dimensions | 31mm x 31mm |
| Maximum Temperature (TCASE) | 110°C |
| PCI Support | 6 ports (32-bit/33MHz) |
| USB Ports | 8 ports (USB 2.0) |
| SATA Ports | 2 ports |
| Integrated LAN | 10/100 Mbps |
| IDE Channels | 2 channels |
Advanced Technology Features
- Intel AC97 Audio Technology Support
- Embedded Options Available for Custom Applications
Note: This chipset does not support Intel ME Firmware, Quick Resume Technology, Quiet System Technology, HD Audio Technology, or Matrix Storage Technology.
Application Benefits
Ideal for mobile computing platforms requiring reliable chipset performance with comprehensive I/O connectivity. The compact BGA package and thermal rating up to 110°C make this solution suitable for space-constrained mobile applications.
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol