K3RG3G30MM-MGCH 3GB LPDDR3 DRAM Memory Chip - 366-Pin BGA Package for Low-Power Applications
Price:
Negotiation
MOQ:
1 package
Delivery Time:
3-5 work days
Product Description
Product Overview
The K3RG3G30MM-MGCH is a high-performance 3GB LPDDR3 DRAM memory chip designed for low-power applications requiring reliable data storage and fast access speeds.
Key Features
- 3GB storage capacity with LPDDR3 technology
- Low power consumption for energy-efficient operation
- 366-pin BGA package with surface mount compatibility
- Fine Pitch Ball Grid Array (FBGA) construction
- Active lifecycle status for immediate deployment
Technical Specifications
| Memory Type | LPDDR3 DRAM |
| Capacity | 3GB |
| Package Type | Ball Grid Array (BGA) |
| Package Family | FBGA (Fine Pitch Ball Grid Array) |
| Pin Count | 366 pins |
| Mounting Type | Surface Mount |
| Lead Shape | Ball |
| ECCN Classification | EAR99 |
| Introduction Date | January 19, 2016 |
Compliance & Standards
EU RoHS: Status unknown under version 2002/95/EC
Supplier Cage Code: 1542F
Application Areas
Ideal for mobile devices, embedded systems, IoT applications, and other electronics requiring compact, low-power memory solutions with 3GB capacity.
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Get in Touch
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol