KLMBG4WEBD-B031 32GB eMMC Memory Chip BGA Package 11.5x13mm with HS400 Interface for Mobile Storage
Price:
Negotiation
MOQ:
1 package
Delivery Time:
3-5 work days
Product Description
Product Overview
The KLMBG4WEBD-B031 is a 32GB eMMC memory chip designed for mobile storage applications, featuring eMMC 5.0 interface and BGA packaging for compact integration.
Key Features
- High-speed HS400 interface for fast data transfer
- Superior power efficiency for extended battery life
- Compact 11.5 x 13 x 1.0 mm BGA package for slim mobile designs
- Wide operating temperature range: -25°C to 85°C
- Dual voltage support: 1.8V / 3.3V operation
Technical Specifications
| Memory Density | 32GB |
| Interface Version | eMMC 5.0 |
| Interface Speed | HS400 |
| Operating Voltage | 1.8V / 3.3V |
| Package Dimensions | 11.5 x 13 x 1.0 mm |
| Operating Temperature | -25°C to 85°C |
| Product Status | EOL (End of Life) |
Application Benefits
This eMMC memory chip delivers optimal performance for mobile storage with fast read/write speeds and excellent power efficiency, making it ideal for developing slim, high-performance mobile devices and embedded systems.
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol