KMRV50014M-B809 EMCP Memory Chip 128GB eMMC 5.1 + 32Gb LPDDR3 1866MHz 221FBGA Package
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
KMRV50014M-B809 EMCP Memory Chip
High-performance embedded multi-chip package combining 128GB eMMC storage and 32Gb LPDDR3 DRAM in a single 221FBGA package, operating at 1866Mbps speed.
Technical Specifications
| Parameter | Specification |
|---|---|
| eStorage Density | 128 GB |
| eStorage Version | eMMC 5.1 |
| DRAM Density | 32 Gb |
| DRAM Type | LPDDR3 |
| Package Type | 221 FBGA |
| Operating Speed | 1866 Mbps |
| Product Status | Mass Production |
Key Features
- Integrated 128GB eMMC 5.1 flash storage for high-capacity data retention
- 32Gb LPDDR3 DRAM providing 1866MHz performance for fast processing
- Compact 221-ball FBGA package design for space-constrained applications
- Currently in mass production ensuring reliable supply chain availability
- Ideal for embedded systems, industrial computing, and microprocessor applications
Applications
This EMCP memory solution is designed for demanding embedded applications including industrial automation, automotive systems, networking equipment, and high-performance computing platforms requiring both substantial storage and fast memory access.
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol