Intel Core i5-4210H Mobile Processor 2.9GHz 3.5GHz Turbo 2-Core 4-Thread 3MB Cache BGA1364
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
Intel Core i5-4210H Mobile Processor
High-performance dual-core laptop CPU with 2.9GHz base frequency, 3.5GHz turbo boost, and integrated HD 4600 graphics. Manufactured using 22nm process technology with 3MB L3 cache and 47W TDP.
Processor Overview
The Intel Core i5-4210H is a fast dual-core mobile processor launched in Q3 2014, featuring Haswell architecture and 22nm manufacturing process. With Hyper-Threading technology, the processor supports up to four simultaneous threads for improved multitasking performance.
Technical Specifications
| Specification | Details |
|---|---|
| Processor Number | i5-4210H |
| Base Frequency | 2.9 GHz |
| Maximum Turbo Frequency | 3.5 GHz (1 core), 3.4 GHz (2 cores) |
| Number of Cores | 2 |
| Number of Threads | 4 |
| L3 Cache Size | 3 MB |
| Thermal Design Power | 47 W |
| Manufacturing Process | 22 nm |
| Socket | BGA1364 |
| Memory Support | DDR3L-1333, DDR3L-1600 |
| Integrated Graphics | HD 4600 (400-1150 MHz) |
Architecture Features
Core Specifications
- Haswell microarchitecture with C0 stepping (SR1Q0)
- 64-bit data width with EM64T support
- Level 1 cache: 2 x 32KB instruction + 2 x 32KB data
- Level 2 cache: 2 x 256KB
- Level 3 cache: 3MB shared
Instruction Set Extensions
- MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2
- AES, AVX, AVX2, F16C, FMA3
- BMI1, BMI2 bit manipulation instructions
Advanced Technologies
- Hyper-Threading technology
- Turbo Boost 2.0 technology
- Virtualization technology (VT-x, VT-d)
- Enhanced SpeedStep technology
- Execute disable bit (NX/XD)
Integrated Components
| Component | Specifications |
|---|---|
| Graphics Controller | Intel HD Graphics 4600 (GT2, Gen 7.5) with 20 execution units, supporting up to 3 displays at 400-1150 MHz |
| Memory Controller | Dual-channel DDR3L-1333/1600 with 25.6 GB/s bandwidth |
| Maximum Memory | 32 GB |
| Interfaces | Direct Media Interface 2.0, PCI Express 3.0 |
Thermal and Power Management
| Parameter | Value |
|---|---|
| Maximum Operating Temperature | 100°C |
| Thermal Design Power (TDP) | 47 W |
Product Lifecycle
| Event | Date |
|---|---|
| Introduction Date | July 20, 2014 |
| Last Order Date | July 1, 2016 |
| Last Shipment Date | January 6, 2017 |
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol