Green Laser Diamond Cutting System for superhard materials CVD, PCD, MCD, CBN
Product Overview
The SY-CVD11E is a 532 nm green laser cutting system designed for precision cutting/slicing of superhard materials. The provided material indicates typical applications include natural diamond, lab-grown diamond, and other superhard materials such as CVD, PCD, MCD, and CBN.
Why 532 nm Green Laser (Key Processing Advantages)
Green laser (532 nm) in this system is generated by frequency doubling of 1064 nm. The material emphasizes that, compared with 1064 nm (described as “red laser” in the document), 532 nm provides:
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Higher processing efficiency;
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Smoother cut surfaces;
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Reduced graphitization (lower undesired graphitization during processing).
These points are positioned as practical benefits for achieving better cut quality and more stable results when processing diamond and similar superhard materials.
Mechanical & Optical Stability Design
To enhance long-term stability and precision, the machine uses natural marble as the optical base, which the material describes as beneficial for improving laser output stability and overall machining precision during operation.
The laser source adopts water-circulation cooling. The document also notes that the core pump module uses a “USA CEO pump module” (wording as stated in the source) to support stable, long-duration operation.
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System Configuration (Main Modules)
The system is described as an integrated platform including:
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Laser system (532 nm output)
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Optical path system
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Software system (self-developed cutting software)
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Control system (dedicated control card + programmable controller, with industrial PC)
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Vision imaging system
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Motion system (XYZ positioning/cutting execution)
Dust extraction: the machine provides only a dust-removal interface; the dust collector is not included.
Main Technical Specifications
| Item | Specification |
|---|---|
| Laser wavelength | 532 nm |
| Laser power | 20 W @ 10 kHz |
| Cooling method | Water cooling |
| Travel range | X 150 mm; Y 150 mm; Z 70 mm |
| Accuracy | XYZ ±0.002 mm |
| Repeatability | XYZ ±0.001 mm |
| Max stage speed | 500 mm/s |
| Control | Googol motion control card; self-developed cutting software; industrial computer |
| Vision | 1.3 MP HD industrial camera |
| Total power | 2 kW |
| Total weight | Approx. 6800 kg |
| Machine dimensions | 990 (L) × 850 (W) × 1770 (H) mm |
Slicing / Cutting Reference Data (From the Material)
| Slice size (mm) | Max kerf width (μm) | Cutting time (min) | Top-to-bottom tolerance (μm) |
|---|---|---|---|
| 7 × 7 | 230 | 20 | 30 |
| 10 × 10 | 320 | 42 | 30 |
| 15 × 15 | 600 | 160 | 30 |
Interpretation (staying within the source information)
The examples show that as slice size increases, kerf width and cutting time increase accordingly, while the listed top-to-bottom tolerance remains 30 μm in the provided reference cases.
FAQ – Green Laser Diamond Cutting System
What materials can it process?
According to the product material, typical applications include natural diamond, lab-grown diamond, and superhard materials such as CVD, PCD, MCD, and CBN.
Why does it use a 532 nm green laser?
The document states the 532 nm green laser is generated by frequency doubling of 1064 nm, and compared with 1064 nm (referred to as “red laser” in the material), it offers:
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Higher processing efficiency
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Smoother cut surface
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Less graphitization
What are the key laser specifications?
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Wavelength: 532 nm
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Laser power: 20 W @ 10 kHz
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Cooling: Water cooling
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