Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
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14 Years
Since 2012
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Hot Air Head And Mounting Head Integration Design BGA Rework Station

Price Negotiable
Price: Negotiable
MOQ: 1 set
Delivery Time: 7~9 work days
Brand: HSTECH
Product Description

 

Hot Air Head And Mounting Head Integration Design BGA Rework Station

 

​Specification

BGA Rework Station Model:HS-800
Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
Bottom Pre-Heating IR 5000w
Temperature control K-type thermocouple,close loop control
Locating way Outer or location hole
Overall dimension L970mm*W700mm*H830mm
PCB size W650*D610mm
BGA size Max 80mm*80mm Min 1mm*1mm
Applicable PCB thickness 0.3 - 5mm
Mounting accuracy ±0.01mm
Weight of machine 140KG

 

Features

1.Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2.Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster. (the temperature can be up to 50 to 80 centigrade).
3.Independent 3 heaters. upper and lower heaters can realize move synchronously and automatically, can reach IR every position. Lower heater zone can remove up and down, support PCB board.
4.PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
5.Unique bottom preheating table made of Germany-imported good quality heating materials plated.
6.Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
7.X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient.
8. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.
9.Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.
10.Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.
11.Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 80*80MM;
12.With 10 segments of temperature up (down) and 10 segments of constant temperature control, can save many segments of temperature.
13.Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
14.With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
15.With a solid operation display function to make the temperature control more reliable.

 

Application

Suitable for mobile phones, hard drives, keyboards, electronic toys, computers, DVD, dots, plastics, electrical appliances, communication equipment, electrical appliances, toys, electronic processing, motors, motors, parts, tablets, notebook computers, digital cameras, remote controls, walkie-talkie, etc.

 

About Packaging

 

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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