Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
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Machinery Electronics Production Machinery

JUKI E36027290A0 503 Chip Shooter Nozzle, Ceramic & Tungsten Steel

Price Negotiable
Price: Negotiable
MOQ: 5pc
Delivery Time: 1-3 work days
Brand: JUKI
Product Description

Compatible with JUKI2000 Chip Shooter Silver and Green Color 503 E36027290A0

 

Introduction

 

This 503 nozzle type, compatible with JUKI2000 Series chip mounter.Made of Ceramic, made of Tungsten Steel and Rubber.

It's suitable for Component Placement, like cathode capacitance, diode, SOT, QFN, BGA and so on.

 

Specifications

 

Brand JUKI
Parts number E36027290A0
Model number M3180301021
Nozzle type 503
Chip mounter 20000series
Nozzle size 31x16mm / 1.22x0.63 inch(Height x Diameter)
Nozzle color Sliver and green
Material Tungsten steel
Weight 8g/0.353 ounces
Package Customized Blister

 

Features

 

1, Using high quality materials, ceramic, tungsten steel and rubber, better mounting performance and long lifespan.

2, The nozzles are well packed by the customized blister, won't be broken during the shipment.
3, Standard size without any error, high precision.

4, Green and slive color designed, good appearance and environment protected.
5, Suitable for Component suction and placement, like cathode capacitance, diode, SOT, QFN, BGA and so on.

 

JUKI 2000 Series nozzle models

 

E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
 

SMT production line equipment:

 

1. SMD machine: the use of equipment edited by the program will be components mounted on the designated parts position, can be mounted SOP 28pin or more (including high-speed machine can be mounted components) rolls, discs or tubes of packaging components. Characterised by high mounting accuracy, diversification, but the mounting speed is inferior to high-speed machines.
2. Reflow soldering: SMT solder paste or red glue using the temperature to set the appropriate temperature profile so that the solder paste and parts to complete the welding action.
3.Unloader: Through the transmission track, the board is collected in the magzine.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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