High-Speed Automatic Solder Paste Machine for Industrial 4.0 MES System

Price Negotiable

Price: Negotiation

MOQ: 1 set

Delivery Time: 7-15days

Brand: GKG

Product Description

Automatic Solder Paste Printer for Industrial 4.0 MES System

Specification

Model	G9+
Max PCB Size	450x340mm
Min PCB size	50x50mm
PCB thickness	0.4-6mm
Max board weight	5kg
Transport height	900±40mm
Board edge gap	2.5mm
Board height	15mm
Transport direction	L-R,R-L
Transport speed	max 1500mm/s, program control
Transport method	One stage
WIdth adjustment	automatic
I/O interface	SMEMA
PCB positioning (support method)	Magnetic pin/support block/manual up-down table
PCB clamping system	Patented over the top clamping
	Side clamping
	Adsorption function
Print snap-off	0-20mm
Print mode	one/twice
Print Speed	10-200mm/sec
Print Mode	One /Twice
Squeegee Type	Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure	0.5-10kg
Template fram size	470370mm~737737mm(20-40thickness)
Cleaning System	Droops of rain type cleaning system
	Reinforced vacuum absorption
	Dry, wet vacuum three modes
	Back and forth cleaning
CCD FOV	10x8mm
Fiducial mark types	Standard Fiducial mark shape
	Pad
	Hole
Camera system	Look up/down optics structure
	CCD digital camera
	Geometry pattern match

Features

The CCD digital system boasts an innovative optical path design that provides uniform circular lighting and high-brightness coaxial illumination. The adjustable brightness of both light source systems, in an infinite loop, allows for seamless recognition of diverse mark points, including uneven ones on tin-plated, copper-plated, silver-plated surfaces, hot-air soldering points, FPCs, and PCBs of varying colors.
The system offers high-precision PCB thickness adjustment and a sturdy structure that guarantees stable XY movement. Manual adjustments make accommodating different PCB thicknesses straightforward.
The guide rail positioning system incorporates a detachable new pattern guide rail and a programmable flexible side clamp, tailored for FPCs and warped PCBs. A unique clamping plate device, controlled by software programming, automatically adapts to various PCB thicknesses without any issues.
The innovative squeegee structure design incorporates a comprehensive squeegee system that enhances stability and prolongs the squeegee's lifespan.
The high-speed stencil cleaning system features a downward dispensing cleaning structure that prevents clogged openings, a common issue that can lead to ineffective cleaning. The solvent dispense length can be effortlessly adjusted via software control.
The new multi-function interface is user-friendly, intuitive, and easy to understand. Additionally, it includes real-time monitoring of temperature and humidity.

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