30CC PUR Jetting Valve

1. The PUR injection valve comprises several modules: a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module, and a heat dissipation module.

2. The barrel heating module supports the barrel and provides controlled, single-stage heating to initialize the gel's warming process.

3. The pressurized cap module ensures the drum is sealed and pressurized, managing the output pressure via a controller.

4. The heat dissipation module effectively dissipates heat and minimizes noise emanating from the valve body.

5. The piezoelectric injection valve employs a modular design. The section in contact with the gel is configured as the runner module, while the non-contact section is the valve body module.

6. The flow path module can be customized to fulfill dispensing needs across various applications.

7. Nozzle diameters are available in a range from 40µm to 500µm.

8. Nozzles are categorized into three types: flat jet, needle, and extension.

9. Runner modules require regular cleaning in an ultrasonic cleaner. It's crucial to avoid immersing seals in organic solvents. Nozzle cleaning necessitates special tools to prevent damage.

 
Nozzle and barrel heating

1. Before dispensing, the nozzle must be heated to an appropriate temperature. The heating device utilizes a two-stage heating mode for this purpose.

2. By maintaining a constant temperature at the nozzle, the gel's optimal performance is ensured, allowing the colloid to function at its best.

 
Specification

 
Advantages
1.The barrel heating is suitable for 30cc, 100cc, 300cc hot melt adhesive with different volume.
2. Modularized design, easy to replace parts, simple debugging, wide range of process applications.
3. Spray volume can be accurate to 0.3nL, spray adhesive spot consistency accuracy of up to 98%.
4. Minimum 0.17mm line width, minimum 0.15mm spot diameters of hot melt glue spraying process can be realized.
5. Can match any motion platform on the market.
 
Application Field
SMT/FPC/PCB,Assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry,Non-marking lingerie industry.