Self-locked Precisely Cut PCB Depaneling Machine with 300mm/s Cutting Speed for PCB Separation
Price:
negotiation
MOQ:
1 set
Delivery Time:
5-7 days
Brand:
HSTECH
Product Description
Self-locked And Precisely Cut Knife Type Board Separator With PC Board for PCB Cutting
In PCB manufacturing, multiple identical small circuit boards are often assembled into a single large board for production efficiency. After assembly completion, these boards require clean, non-destructive separation through a process called depaneling. This specialized machine performs this critical function with precision and reliability.
Technical Specifications
| Power Supply | Single-phase AC220V 50-60HZ |
| Weight | 60KG |
| Machine Dimensions | 770mm (L) × 370mm (W) × 420mm (H) |
| Cutting Speed | 300mm/s |
| Maximum Knife Wheel Stroke | 350mm |
| Knife Wheel Fine Adjustment | 0-3mm |
| Lower Knife Adjustment | 0-2mm |
| Maximum PC Board Cutting Width | 150mm |
| Maximum PC Board Cutting Length | 350mm |
| PC Board Thickness Range | 0.6-3.2mm |
| V-Groove Thickness Range | 0.25-2.0mm |
Key Features & Benefits
- Infrared safety protection system stops machine operation when hands or foreign objects enter the cutting area
- Stepper motor drive enables self-locking and precise cutting positioning when powered
- Eliminates travel point variations common with DC and AC motors due to inertia
- Prevents damage to circuits and electronic components during separation
- Significantly improves work efficiency and production quality
- Upper circular knife and lower flat knife design reduces stress during cutting
- Prevents solder joint cracking and component breakage
- Produces smooth, clean cuts without board separation issues
- High-speed steel blades offer durability and can be re-sharpened approximately twice
Depaneling Technology Comparison
Scoring Depaneler
Principle: High-speed rotating milling cutter cuts along pre-designed V-grooves
Advantages: Fast operation, relatively low cost, suitable for simple shapes and straight lines
Disadvantages: Generates stress dust and places stress on board edges, unsuitable for fragile or high-density boards
Advantages: Fast operation, relatively low cost, suitable for simple shapes and straight lines
Disadvantages: Generates stress dust and places stress on board edges, unsuitable for fragile or high-density boards
Routing Depaneler
Principle: CNC-style high-speed spindle drives milling cutter along programmed paths
Advantages: Minimal stress, capable of cutting any shape (curved or irregular), high precision with clean edges
Disadvantages: Slower than scoring, higher equipment and maintenance costs
Applications: Mobile phones, automotive electronics, aerospace, and other high-reliability applications
Advantages: Minimal stress, capable of cutting any shape (curved or irregular), high precision with clean edges
Disadvantages: Slower than scoring, higher equipment and maintenance costs
Applications: Mobile phones, automotive electronics, aerospace, and other high-reliability applications
Laser Depaneler
Principle: High-energy laser beam melts material for contactless cutting
Advantages: Completely stress-free, extremely high precision, narrow kerf, dust-free, suitable for delicate FPCs
Disadvantages: High equipment cost, relatively slow cutting speed, complex parameter adjustments for different materials
Advantages: Completely stress-free, extremely high precision, narrow kerf, dust-free, suitable for delicate FPCs
Disadvantages: High equipment cost, relatively slow cutting speed, complex parameter adjustments for different materials
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin