Molybdenum Wafer Substrate for semiconductor and LED chips Mo, MoCu 25.4mm 1inch

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

​

• Description

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials:

In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

The semiconductor layer in the LED chip converts current into light. The semiconductor layer is composed of an electron region (N-type doping) and a hole region (P-type doping). Current flows through the semiconductor layer, and electrons combine with holes to emit light in the form of photons. The remaining energy is released as heat radiation at temperatures up to 85 °C.

Future LEDs will have higher brightness and operating temperatures will increase. JINXING uses different materials for different needs to provide customers with thermal solutions. For example, LED vertical structure chips based on sapphire or silicon-based substrates, we supply pure molybdenum substrates; and, as we have developed for the vertical structure of sapphire substrates, molybdenum copper and tungsten-copper composites.

The available molybdenum and molybdenum-copper wafer substrates have a minimum thickness of 0.05 mm and a minimum diameter of 2 in. We can even supply wafer substrates up to 4 inches in diameter or larger. The roughness and flatness of the wafer substrate have a decisive influence on the bonding process with the semiconductor layer. We offer surface treatments for different processes, please contact us.

If you need, our molybdenum, molybdenum-copper and tungsten-copper wafer substrates can be coated. For example, our nickel-gold coatings are resistant to oxidation and prevent corrosion of the substrate. In addition, our nickel-gold layer is the solder or bonding interface of the reflective layer and the heat sink.