Tungsten Copper Electronic Packaging Sheet/Wcu Alloy Sheet /Tungsten Copper Composite (WCu)

It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3,BeO),Semiconductors (Si),Metals (Kovar),etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.

The quality of our composite is the leader in China, contributed with our strict quality control measures. Our porosity is very low; our surface/volume ratio(measured with BET) is only 50% of similar products of 100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticity and can pass the He mass-spectrometer leak test (<<5*-9Pa·/S)Our Tungsten Copper Composite Features:No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermal conductivity

Tungsten Copper Electronic Packaging Sheet Features:

1. The highest melting point of all metals , relatively stable chemical properties

2. Excellent resistance to electrochemical corrosion , not easily corroded by air .

3. High wearability ,High hardness, high density.

4. Good high temperature strength.

5. Good electron emission properties .

6. Mechanical properties mainly determined by the pressure processing and heat treatment process status.

 Tungsten Copper Electronic Packaging Sheet picture: