Heat Sink Package Tungsten Copper Alloy Polished Grinding
Tungsten Copper Heat Sink Package Sheet,Tungsten Copper Shim,Tungsten Copper Sheet
Product Introduction:
W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience
Tungsten Copper Heat Sink Package Sheet Advantages
· High thermal conductivity
· Excellent hermeticity
· Excellent flatness, surface finish, and size control
· Semi-finished or finished (Ni/Au plated) products available
Tungsten Copper Heat Sink Package Sheet are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
hysical Properties of Major Products
| Mark | Wt%(W) | Wt%(Cu) | Density at 20ºC |
Thermal conductivity at 25ºC | Coefficient of thermal expansion at 20ºC |
| W90Cu10 | 90±1 | rest | 17.0g/cm3 | 180-190 | 6.5 |
| W85Cu15 | 85±1 | rest | 16.4g/cm3 | 190-200 | 7.0 |
| W80Cu20 | 80±1 | rest | 15.6g/cm3 | 200-210 | 8.3 |
| W75Cu25 | 75±1 | rest | 14.9g/cm3 | 220-230 | 9.0 |
| W50Cu50 | 50±1 | rest | 12.2g/cm3 | 310-340 | 12.5 |
Tungsten Copper Heat Sink Package Sheet Picture
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