Thermal Management W60Cu40 Tungsten Copper Alloy
Tungsten Copper Heat Sinks For Thermal Management,Copper Tungsten Heat Sink W60Cu40 heat sinks
Copper tungsten is the pseudo-alloy who has the advantage of the high thermal conductivity of copper and the low coefficient of thermal expansion of tungsten. It is easy to adjust the CTE( coefficient of thermal expansion)by use the different ratio of copper and tungsten.Tungsten copper sheets have very high in plane conductivity provide by layers of copper and low thermal expansion provided by the inner layer of molybdenum. These laminated sheets have the ability to spread the heat from a concentrated heat source and then dissipate the heat through the layers.
Tungsten copper heat sinks are extensively used as thermal mounting plates, chip carriers, flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like:
pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.
Properties of Different Types of Tungsten Copper Heat Sink Facts:
| Grade | Cu(%wt.) | W(%wt.) | Density | Electrical conductivity | Coefficient of thermal conductivity | coefficient of thermal expansion |
| WD10070 | 30±2 | Balance | 13.80g/cm3 | 42%IACS | ~240(W/mK) | ~9.7(10-6/K) |
| WD10075 | 25±2 | Balance | 14.50g/cm3 | 38%IACS | 200~230 (W/mK) | 9.0~9.5 (10-6/K) |
| WD10080 | 20±2 | Balance | 15.20g/cm3 | 34%IACS | 190~210(W/mK) | 8.0~8.5 (10-6/K) |
| WD10085 | 15±2 | Balance | 15.90g/cm3 | 30%IACS | 180~200(W/mK) | 7.0~7.5(10-6/K) |
| WD10090 | 10±2 | Balance | 16.80g/cm3 | 28%IACS | 160~180(W/mK) | 6.3~6.8(10-6/K) |
Advantages:
o High thermal conductivity
o Excellent hermeticity
o Excellent flatness, surface finish, and size control
o Semi-finished or finished (Ni/Au plated) products available
Tungsten Copper Heat Sinks Picture:
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.