Ultra-Thin Metal Bonded Diamond Cutting Blade, 

Metal Bonded Diamond Dicing Blade Type: RTM1A8-004

To abrasive or cut  Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc

Sample specification:   50*40*0.32 mm  ( D * H * T )

Diamond wheel shape and indicates:

D -- Out Diameter

H -- Inner Diameter

T -- Thickness

• Above form only a range of the data, we can make blades entirely as per client's requirement.    

Main Features of Metal Sintered Dicing Blades :

• Customized products, Variety specification availabe as per client's size;

• High precision cutting;

• Minimized blade wear;

• Good stability;

• Long life using;

• Sharp and Durable.

Application of our Ultra-thin blades:

• Semiconductor, such as BGA, LGA, LED,etc.;

• Optical glass, such as filter, blue glass, crystal, gem, etc.;

• Optical communication, such as slotting-shape on quartz and cutting off quartz cover;

• Other materials, such as slotting and cutting off magnetic materials, carbide, tool steel, stainless steel.

More Pictrures of our blades:

Our Order Operating Procedure:

Over 15 years of developing and producing experience in high precision super hard material tools, we have 

established a high efficiency system to provide stable performance wheel products.

We welcome yr free inquiry for any question in our diamond cutting wheels.  In order to supply exact wheel 

type and quotatioon to you,  if possible, better for you to provide us more information like followings:

1. Yr processing objects.

2. Yr OD, ID, Thickness data.

3. Grit size if possible.

4.  Rotary speed of your processing machine.

Many Thanks.