Today, we're going to introduce a newly shipped PCB based on DiClad 870 laminates.

Introduction of DiClad 870:

Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites that offer lower dielectric constant for use as printed circuit board substrates. By using fewer plies of woven fiberglass and a higher ratio of PTFE content, the DiClad 870 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness to other laminates in the DiClad series. The woven fiberglass reinforcement in DiClad 870 provides greater dimensional stability than nonwoven fiberglass reinforced PTFE based laminates of similar dielectric constants. The coated fiberglass plies in DiClad 870 materials are aligned in the same direction.

Features:

Dielectric constant (Dk) of 2.33 at 10 GHz and 1 MHz, 50% RH
Dissipation factor of 0.0013 at 10 GHz, 0.0009 at 1MHz, 50% RH
Moisture Absorption 0.02%
CTE in X-axis of 17 ppm/°C, Y-axis of 29ppm/°C and Z-axix of 217ppm/°C
Copper Peel Strength of 14 lbs/in
UL 94-V0 Flammability
NASA outgassing: Total mass loss of 0.01%, Collected Volatiles of 0.01%, Water vapor recovered of 0.01%

Benefits:

Extremely Low Loss Tangent
Excellent Dimensional Stability
Product Performance Uniformity
Electrical Properties are Highly Uniform Across Frequency
Consistent Mechanical Performance
Excellent Chemical Resistance
Lowest moisture absorption among PTFE based composites
Stable Dk over a wide frequency range
Low Dk supports wider line widths for lower insertion loss

PCB Stackup:
The PCB stackup for the DiClad 870 laminate is a 2-layer rigid design. It consists of 35 μm copper layers on the top and bottom, with a 0.127 mm (5 mil) thick DiClad 870 dielectric layer in between.

PCB Construction Details:
The board dimensions are 63.44 mm x 49.5 mm, with a tolerance of ±0.15 mm. The minimum trace/space requirement is 4/5 mils, and the minimum hole size is 0.20 mm. There are no blind vias used in the design. The finished board thickness is 0.2 mm, and the copper weight on the outer layers is 1 oz (1.4 mils). The via plating thickness is 20 μm, and the surface finish is ENIG. No silkscreen or solder mask is used on the board.

PCB Statistics:

This PCB has a total of 4 components. There are 8 total pads, with 5 being through-hole and 3 being top-side SMT. It also includes 10 vias and 1 net.

Artwork Supplied: The artwork for this PCB is provided in Gerber RS-274-X format.

Accepted Standard: The PCB is manufactured to the IPC-Class-2 standard.

Availability: This PCB is available worldwide.

Typical Applications:
Radar feed networks
Commercial phased array networks
Low-loss base station antennas
Guidance systems
Digital radio antennas
Filters, couplers, LNAs