Introducing our newly shipped 12-layer Printed Circuit Board (PCB), designed for superior performance and reliability in demanding electronic applications. This advanced PCB is engineered with high-quality materials and meticulous attention to detail, making it an ideal solution for a variety of industries, including automotive, telecommunications, and data storage.

Exceptional Specifications
This 12-layer PCB is constructed with precision and care, utilizing high-quality materials that enhance performance and reliability. The board is made from IT-180A and FR-4, with a glass transition temperature (Tg) of 170 °C. The solder mask, applied to both sides, features a striking matte red finish, while the top layer sports a clean white silkscreen print for improved visibility and branding.

The surface finish is ENIG (Electroless Nickel Immersion Gold), ensuring superior solderability and resistance to corrosion. With a total board thickness of 1.6mm (±10%) and dimensions of 80.15mm x 76.6mm, this PCB is designed for high-density applications. It accommodates a minimum hole size of 0.2mm, a solder mask thickness of 10um, and a minimum dielectric thickness of 100um.

Electrical and Mechanical Specifications
 

Key electrical specifications include:

Minimum Trace Line Width: 120um
Minimum Spacing: 125um
Plated Through Holes: Present across all layers (L1-L12)
Blind Vias: Not applicable
 

The PCB also features impedance-controlled differential pairs, which are critical for maintaining signal integrity in high-speed applications. Configurations include:

50 Ohm: Top layer (4mil trace/gap)
90 Ohm: Top layer (5mil trace/gap)
100 Ohm: Top layer (6mil trace/gap)
 

This comprehensive range of specifications makes our PCB suitable for a variety of demanding applications.

Innovative Stack-Up
The stack-up configuration of this PCB is meticulously designed to optimize both electrical performance and thermal management. The configuration includes alternating layers of copper and FR-4, creating a robust structure that minimizes interference while enhancing signal propagation.

Layer Composition
The stack-up consists of the following:

Copper Layers: Strategically placed to provide effective heat dissipation.
 

FR-4 and IT-180 Core Layers: Ensuring long-term durability and reliability.

This thoughtful layering not only maximizes the electrical characteristics of the PCB but also contributes to its overall integrity, making it suitable for complex and high-density designs.

Commitment to Quality and Compliance
Produced in compliance with IPC-Class-2 standards, this PCB ensures a moderate level of reliability suitable for consumer electronics. The artwork is supplied in the Gerber RS-274-X format, facilitating easy integration with standard manufacturing processes.

Advanced Material: IT-180ATC
A significant advantage of our 12-layer PCB is the use of IT-180ATC, a high-performance epoxy known for its exceptional thermal properties. With a dielectric constant of 4.1 at 10GHz and a dissipation factor of 0.017, this material is ideal for high-frequency applications.

Key Features of IT-180ATC
Thermal Resistance: T260 > 60 minutes, T288 > 20 minutes
Peel Strength: Minimum of 8 lbs/inch
Coefficient of Thermal Expansion (CTE): Matched to copper (X-axis: 11-13 ppm/°C, Y-axis: 13-15 ppm/°C)
Low Z-axis CTE: 45 ppm/°C
Tg: Greater than 175 °C
Low Moisture Absorption: 0.1%
Flammability Rating: UL 94-V0

These properties make IT-180ATC an excellent choice for PCs requiring high thermal reliability and resistance to environmental stressors.

Versatile Applications
Our new 12-layer PCB is versatile and adaptable, making it suitable for a wide range of applications, including:

Automotive Systems: Particularly in engine room electronic control units (ECUs) that require high reliability.
 

Backplanes: Supporting high-density interconnects for servers and data storage solutions.
 

Telecommunications: Essential infrastructure for various networking technologies, ensuring robust communication pathways.

Conclusion
This 12-layer PCB represents a significant advancement in PCB technology, engineered to meet the demands of modern electronics. With its exceptional specifications, innovative materials, and versatile applications, this PCB is poised to become a go-to solution for manufacturers and engineers alike.