Taconic 31mil TLX-8 PCB 2-layer Immersion Gold
Price:
USD9.99-99.99
MOQ:
1PCS
Delivery Time:
8-9 working days
Brand:
Bicheng
Product Description
Taconic 31mil TLX-8 PCB 2-layer Immersion Gold
This high-reliability 2-layer PCB leverages Taconic TLX-8, a top-tier PTFE fiberglass laminate specifically crafted for robust RF and microwave operations. Engineered to withstand harsh conditions--ranging from intense vibrations to radiation exposure and extreme temperature fluctuations--it boasts exceptional Passive Intermodulation (PIM) performance, consistent dielectric characteristics, and superior dimensional stability, fully complying with IPC-Class-2 quality benchmarks.
PCB Specification
| Parameter | Details |
|---|---|
| Base Material | Taconic TLX-8 (PTFE fiberglass laminate) |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 25mm x 71mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold - ensures corrosion resistance, reliable soldering, and long-term contact integrity |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Core | Taconic TLX-8 | 0.787 mm (31 mils) |
| Copper Layer 2 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
Material Overview: Taconic TLX-8
Taconic TLX-8 is a versatile PTFE fiberglass laminate designed for high-volume antenna and microwave applications, where reliability in extreme environments is critical. Its formulation balances mechanical reinforcement (from fiberglass) with the low-loss properties of PTFE, making it suitable for low-layer-count designs that endure harsh conditions--including high vibration (e.g., space launch), extreme temperatures (e.g., engine modules, altimeters), radiation (e.g., space systems), and marine exposure (e.g., warship antennas). With a wide range of available thicknesses and copper cladding options, it offers flexibility for diverse RF/microwave design needs while maintaining tight control over dielectric properties.
Main Material Properties
| Property Category | Specification | Value | Test Standard |
|---|---|---|---|
| Electrical Properties | Dielectric Constant (Dk) @ 10 GHz | 2.55 ± 0.04 | IPC-650 2.5.5.3 |
| Dissipation Factor (DF) @ 10 GHz | 0.0018 | IPC-650 2.5.5.5.1 | |
| Surface Resistivity (Elevated Temp.) | 6.605 x 10⁸ Mohm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Surface Resistivity (Humidity Cond.) | 3.550 x 10⁶ Mohm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Volume Resistivity (Elevated Temp.) | 1.110 x 10¹⁰ Mohm/cm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Volume Resistivity (Humidity Cond.) | 1.046 x 10¹⁰ Mohm/cm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Electrical Properties | Dielectric Breakdown | >45 Kv | IPC-650 2.5.6 |
| Dimensional Stability | MD After Bake | 0.06 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.4 |
| CD After Bake | 0.08 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.4 | |
| MD Thermal Stress | 0.09 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.5 | |
| CD Thermal Stress | 0.10 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.5 | |
| Thermal Properties | CTE (25-260 °C) - X-axis | 21 ppm/°C | IPC-650 2.4.41 / ASTM D 3386 |
| CTE (25-260 °C) - Y-axis | 23 ppm/°C | IPC-650 2.4.41 / ASTM D 3386 | |
| CTE (25-260 °C) - Z-axis | 215 ppm/°C | IPC-650 2.4.41 / ASTM D 3386 | |
| Decomposition Temp. (Td) - 2% Weight Loss | 535 °C | IPC-650 2.4.24.6 (TGA) | |
| Decomposition Temp. (Td) - 5% Weight Loss | 553 °C | IPC-650 2.4.24.6 (TGA) | |
| Chemical/Physical Properties | Moisture Absorption | 0.02% | IPC-650 2.6.2.1 |
| Flammability Rating | UL 94 V-0 | UL-94 |
Core Benefits
- Exceptional PIM Performance: Measures lower than -160 dBc*, critical for minimizing signal interference in RF/microwave systems (e.g., radar, mobile communications).
- Extreme Environment Resistance: Withstands high vibration, extreme temperatures, radiation, and marine exposure--ideal for space, aerospace, and naval applications.
- Stable Electrical Properties: Low and tightly controlled Dk (2.55 ± 0.04) and low DF (0.0018) ensure consistent signal integrity across wide frequency ranges.
- Dimensional Stability: Minimal expansion/contraction under thermal stress or baking prevents PCB warpage, preserving component alignment and connection reliability.
- Low Moisture Absorption: 0.02% absorption eliminates moisture-related performance degradation, even in humid environments.
- Mechanical Robustness: Fiberglass reinforcement provides durability for designs requiring structural resilience (e.g., bolted PCBs in launch vehicles).
- UL 94 V-0 Rating: Enhances safety by resisting flame spread, suitable for critical systems where fire risk mitigation is key.
Typical Applications
This PCB is optimized for high-reliability RF/microwave systems, including:
- Radar systems
- Mobile communications equipment
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, and amplifiers
- Antennas (e.g., space, naval, aerospace)
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Company
Bicheng Electronics Technology Co., Ltd
Location
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact Person
Ivy Deng