Rogers CLTE-AT PCB 0.2mm Thick 2-layer Immersion Gold
This PCB employs Rogers CLTE-AT as its base material, features an Immersion Gold surface finish, and strictly complies with IPC-Class-2 quality standards. It adopts a double-sided rigid structure, engineered to fulfill the high-performance requirements of RF, microwave, and phase-sensitive electronic systems. The Immersion Gold finish delivers exceptional corrosion resistance, solderability, and long-term reliability, making it well-suited for precision assembly processes.
PCB Construction Details
| Construction Parameter | Specification |
| Base Material | Rogers CLTE-AT (micro-dispersed ceramic PTFE composite with woven fiberglass reinforcement) |
| Layer Count | Double-sided (2-layer rigid structure) |
| Board Dimensions | 56mm × 99mm per unit, with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) and 6 mils (space), minimum |
| Minimum Hole Size | 0.3mm |
| Blind Vias | Not used |
| Finished Board Thickness | 0.2mm |
| Finished Copper Weight | 1oz (1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm, ensuring reliable interlayer conductivity |
| Surface Finish | Immersion Gold |
| Silkscreen | Black silkscreen applied to the top layer; no silkscreen on the bottom layer |
| Solder Mask | Green solder mask on the top layer; no solder mask on the bottom layer |
| Quality Control | 100% electrical testing performed prior to shipment to eliminate potential defects |
Stack-up Configuration
| Layer | Specification | Function |
| Copper Layer 1 | 35 μm (1oz) thickness | Top signal layer, integrated with black silkscreen and green solder mask |
| CLTE-AT Substrate | 0.13mm (5mil) thickness | Low-loss dielectric core layer with exceptional dimensional stability |
| Copper Layer 2 | 35 μm (1oz) thickness | Bottom signal layer, without silkscreen or solder mask |
Rogers CLTE-AT Material Introduction
Rogers CLTE-AT laminates serve as the commercial-grade solution in the CLTE™ product line, adopting core technologies from CLTE-XT™ laminates with cost-optimized modifications. This results in a dielectric constant of 3.00 and a unique thickness profile compared to CLTE-XT variants. As micro-dispersed ceramic PTFE composites, CLTE-AT laminates integrate woven fiberglass reinforcement to achieve outstanding dimensional stability—a critical attribute for complex assemblies, particularly with thin substrates (0.005” and 0.010”).
CLTE-AT laminates deliver best-in-class insertion loss (S21) and a low loss tangent (0.0013) in the commercial market, second only to CLTE-XT. They achieve superior peel strength without relying on the lossier, rougher copper surfaces used in competing products. Furthermore, CLTE-AT features low CTE across XYZ axes and extremely low TCEr, ensuring electrical phase stability, Dk stability, and mechanical stability over an operating temperature range of -55°C to 150°C. It retains the competitive advantages of CLTE laminates, including minimal moisture and process chemical absorption, ease of processability, and enhanced thermal conductivity for improved heat transfer and power handling capabilities.
CLTE-AT Material Features
| Category | Feature | Specification |
| Signal Integrity | Material Composition | Ceramic/PTFE Microwave Composite |
| Mechanical Performance | Woven fiberglass reinforcement | |
| Insertion Loss | Best-in-class (S21) | |
| Thermal & Electrical Stability | Loss Tangent | 0.0013 |
| Dielectric Constant (Dk) | 3.00 ± 0.04 | |
| Thermal Conductivity | 0.64 W/mK | |
| CTE (XYZ Axes) | 8/8/20 ppm/°C | |
| Physical Properties | Flammability Rating | UL 94-V0 |
| Moisture Absorption | 0.03% | |
| Outgassing Properties | TML 0.04%, CVCM 0, WVR 0 |
CLTE-AT Material Benefits
-Exceptional Mechanical Stability: CLTE-AT possesses superior mechanical properties, resisting creep and cold flow to maintain long-term dimensional stability even in harsh operating environments.
-Process Chemical Resistance: The material exhibits high resistance to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication procedures.
-Optimized Copper Adhesion: It achieves excellent peel strength without relying on lossier, rougher copper surfaces, preserving signal integrity while ensuring reliable copper bonding.
-Easy Processability: Compatible with standard PCB manufacturing processes, eliminating the need for specialized techniques and reducing production complexity.
Typical Applications
-Automotive Radar & Adaptive Cruise Control Applications
-Microwave/RF Applications
-Phase/Temperature Sensitive Antennas
-Phase Sensitive Electronic Applications
-RF and Microwave Filters
Quality & Availability
This PCB complies with IPC-Class-2 quality standards, ensuring reliable performance for commercial and industrial electronics. It is available for worldwide supply, supporting global projects and timely international delivery.
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