TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board
This is a high-performance 2-layer rigid printed circuit board (PCB) fabricated with TLX-8 high-frequency laminate, featuring a 30mil (0.762mm) board thickness, 1oz copper weight, immersion gold surface finish, and no solder mask or silkscreen (no oil, no text). This PCB leverages TLX-8’s superior electrical and mechanical properties, making it suitable for various high-frequency applications that demand stable performance and reliable structural integrity.
PCB Specification
| Item | Specifications |
| Base Material | TLX-8 High-Frequency Laminate |
| Layer Count | 2 layers (double-sided PCB) |
| Board Dimensions | 40.5mm x 70.6mm per unit, 1 piece total |
| Finished Board Thickness | 30mil (0.762mm) |
| Finished Copper Weight | 1 oz |
| Surface Finish | Immersion Gold |
| Top/Bottom Solder Mask | Not applied (no oil) |
| Top/Bottom Silkscreen | Not applied (no text) |
PCB Stack-up
| Layer | Description | Thickness |
| 1 | Copper Layer 1 (Outer Top) | 35 μm (1 oz) |
| - | TLX-8 Substrate | 30mil (0.762mm) |
| 2 | Copper Layer 2 (Outer Bottom) | 35 μm (1 oz) |
Introduction to TLX-8 Material
TLX-8 is a high-performance high-frequency laminate engineered for demanding RF, microwave, and high-speed digital applications. It exhibits excellent dielectric properties, low dissipation factor, and superior mechanical stability, making it ideal for applications that require minimal signal loss, reliable thermal performance, and consistent dimensional stability. The material is compatible with standard PCB fabrication processes, ensuring ease of manufacturing while maintaining high performance standards.
TLX-8 Material Properties
| Properties | Conditions | Typical Value | Unit | Test Method |
| Dielectric Constant | @ 10 GHz | 2.55 ± 0.04 | - | IPC-650 2.5.5.3 |
| Dissipation Factor | @ 10 GHz | 0.0018 | - | IPC-650 2.5.5.5.1 |
| Outgassing - % TML | 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr | 0.03 | % | ASTM E 595 |
| Outgassing - % CVCM | 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr | 0.00 | % | ASTM E 595 |
| Outgassing - % WVR | 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr | 0.01 | % | ASTM E 595 |
| Surface Resistivity (Elevated Temp.) | - | 6.605 x 10⁸ | Mohm | IPC-650 2.5.17.1 Sec. 5.2.1 |
| Surface Resistivity (Humidity Cond.) | - | 3.550 x 10⁶ | Mohm | IPC-650 2.5.17.1 Sec. 5.2.1 |
| Volume Resistivity (Elevated Temp.) | - | 1.110 x 10¹⁰ | Mohm/cm | IPC-650 2.5.17.1 Sec. 5.2.1 |
| Volume Resistivity (Humidity Cond.) | - | 1.046 x 10¹⁰ | Mohm/cm | IPC-650 2.5.17.1 Sec. 5.2.1 |
| Dimensional Stability (MD, After Bake) | - | 0.06 | mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.4 |
| Dimensional Stability (CD, After Bake) | - | 0.08 | mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.4 |
| Dimensional Stability (MD, Thermal Stress) | - | 0.09 | mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.5 |
| Dimensional Stability (CD, Thermal Stress) | - | 0.10 | mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.5 |
| Thermal Conductivity | - | 0.19 | W/M*K | ASTM F433/ASTM 1530-06 |
| CTE (25-260 °C) - X | - | 21 | ppm/°C | IPC-650 2.4.41/ASTM D 3386 |
| CTE (25-260 °C) - Y | - | 23 | ppm/°C | IPC-650 2.4.41/ASTM D 3386 |
| CTE (25-260 °C) - Z | - | 215 | ppm/°C | IPC-650 2.4.41/ASTM D 3386 |
| Td (2% Weight Loss) | - | 535 | °C | IPC-650 2.4.24.6 (TGA) |
| Td (5% Weight Loss) | - | 553 | °C | IPC-650 2.4.24.6 (TGA) |
| Peel Strength (1 oz. ED, Thermal Stress) | - | 2.63 (15) | N/mm (Ibs/in) | IPC-650 2.4.8 Sec. 5.2.2 |
| Peel Strength (1 oz. RTF) | - | 2.98 (17) | N/mm² (kpsi) | - |
| Peel Strength (½ oz. ED, Elevated Temp.) | - | 2.45 (14) | N/mm² (kpsi) | IPC-650 2.4.8.3 |
| Peel Strength (½ oz. ED, Thermal Stress) | - | 1.93 (11) | N/mm² (kpsi) | IPC-650 2.4.8 Sec. 5.2.2 |
| Peel Strength (1 oz. rolled) | - | 2.28 (13) | N/mm² (kpsi) | - |
| Young’s Modulus (MD, ASTM D 902) | - | 6,757 (980) | N/mm² (psi) | ASTM D 902 |
| Young’s Modulus (CD, ASTM D 902) | - | 8,274 (1,200) | N/mm² (psi) | ASTM D 902 |
| Young’s Modulus (MD, ASTM D 3039) | - | 11,238 (1,630) | N/mm² (psi) | ASTM D 3039 |
| Moisture Absorption | - | 0.02 | % | IPC-650 2.6.2.1 |
| Dielectric Breakdown | - | > 45 | Kv | IPC-650 2.5.6 |
| Flammability Rating | - | V-0 | - | UL-94 |
Typical Applications of TLX-8 PCB
-RF and microwave communication equipment
-High-speed digital circuits
-Test and measurement instruments
-Aerospace and defense electronic systems
-Satellite communication components
-Radar and navigation systems
-Wireless communication devices
Artwork, Quality Standard and Availability
Artwork for this PCB is provided in the Gerber RS-274-X format, the industry standard for PCB manufacturing, ensuring seamless compatibility with mainstream production equipment and design software. The PCB complies with recognized industry standards, guaranteeing consistent electrical performance, reliable manufacturing quality, and adherence to requirements for high-frequency applications. Furthermore, this PCB is available worldwide, catering to the needs of international customers and high-frequency circuit projects globally.
Conclusion
Due to its excellent dielectric properties, minimal signal loss , superior thermal stability and mechanical reliability. This TLX-8 PCB has become the optimal choice for professionals and project teams engaged in RF communication, microwave systems, high-speed digital circuits, aerospace and defense electronics, satellite communication, radar, navigation, and wireless communication sectors that demand high-performance and stable high-frequency circuit solutions.
Get in Touch
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