Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener
Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener
(FPC’s are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of single layer flexible printed circuit for the application of Wireless Dongle, 0.2mm thick. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting head.
Parameter and data sheet
| Size of Flexible PCB | 230.5 X 40.8mm |
| Number of Layers | 1 |
| Board Type | Flexible PCB |
| Board Thickness | 0.20mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35µm (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 1 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Low cost
Continuity of processing
Focus on low to medium volume production
More than 18 years of experience
Applications
Mobile phone built-in antenna FPC, flex keyboard for mobile phone keys, Industrial control computer soft board
Stiffener
In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.
(1)PI or Polyester
PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.
(2)Glass fibers
Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.
(3)Polymer
Polymer, such as plastic, etc. is also used as stiffeners.
Its water absorption is low, with high pressure and high temperature resistance.
(4)Steel foil, aluminum shim
The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.
More Displays of PI Stiffener
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