High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer
Price:
Negotiable
MOQ:
1pcs
Delivery Time:
0.5-4 week
Brand:
ABIS
Product Description
High Density Interconnect PCB Board Manufacturing
1. 12 layer hdi board with ENIG 3u''.
2. FR4 Tg170 clad.
3. Communication application.
4. Blind/Buried via and via plug.
5. 0.075mm line trace and space.
| 1 | Layers | 12 layer |
| 2 | Material | FR4 tg170 |
| 3 | Board thick | 1.8mm |
| 4 | Usage | Communication |
| 5 | Laser drill size | 0.1mm |
| 6 | Min line trace | 0.075mm |
| 7 | Min space | 0.075mm |
| 8 | Surface treatment | ENIG 3u'' |
| 9 | Copper thick | 105um |
| 10 | Solder mask thick | 10-30um |
| 11 | Buried via | Yes |
| 12 | Via plug | Yes |
| 13 | Certificates | UL,ISO,RoHS,SGS |
FAQ
Q1:HDI means?
A: High density Interconnect.
Q2:How to judge HDI board?
A: Stack up or drill files.
Q3:How to ensure the quality?
A: All boards test ok before shipment.
Q4: How about the lead time?
A: About HDI PCB,our lead time is 4weeks.
Q5: Which products will use it?
A: Mobile,Imaging system,defense system etc.
Q6: What about your certs?
A: ISO9001/14001/16949,UL,RoHS,SGS.
Factory building:
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Abis Circuits Co., Ltd.
Location
4113-4116# A Area, HSST PARK, BAO'AN District, Shenzhen, China
Contact Person
Wendy